Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.

Abstract: An assembly of a die ejecting device and an image capture device includes: an ejector main body; the die ejecting device provided on the ejector main body and configured for ejecting a die adhered to a tape; and the image capture device provided inside the die ejecting device and including: an image capture element for taking images of the ejected die; and an internal light source. Thus, not only can images be simultaneously taken of a die in a wafer and a waiting-to-be-bonded position, but also subsequent die testing and position calibration are made easy. The die can be directly bonded to a die bonding position on a substrate from below, thereby sparing the programs and mechanisms otherwise required for conveying the die with a pick-and-place arm. Consequently, the die transportation time and overall bonding cycle time are shortened, and the production capacity of the die bonding machine is enhanced.