Patents by Inventor Po-Lung Yang

Po-Lung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12249493
    Abstract: A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in the wafer chuck from a fluid inlet port on the wafer chuck, the fluid guiding structure comprising a plurality of arc-shaped channels fluidly communicated with each other; guiding the fluid medium from a first one of the arc-shaped channels of the fluid guiding structure to a second one of the arc-shaped channels of the fluid guiding structure. The second one of the arc-shaped channels of the fluid guiding structure is concentric with the first one of the arc-shaped channels of the fluid guiding structure from a top view.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: March 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Chun Yang, Yi-Ming Lin, Po-Wei Liang, Chu-Han Hsieh, Chih-Lung Cheng, Po-Chih Huang
  • Publication number: 20250062281
    Abstract: The present disclosure provides a semiconductor package. The semiconductor package includes a first die, a plurality of first bonding pads, a plurality of first conductive bumps, a molding layer and a redistribution layer. The first die has a top surface and a bottom surface opposing to the top surface. The first bonding pads are disposed on the top surface of the first die. The first conductive bumps are disposed on the first bonding pads, and the first conductive bumps are electrically connected with the first die. The molding layer covers the top surface of the first die and exposes the first conductive bumps. The redistribution layer is disposed on the molding layer to electrically connect to the first conductive bumps. The present disclosure further provides a method of manufacturing the above semiconductor package.
    Type: Application
    Filed: March 15, 2024
    Publication date: February 20, 2025
    Inventors: Yueh-Ming Tung, Chia-Ming Yang, Tsun-Lung Hsieh, Guan-Lin Pan, Po-Yen Yen
  • Patent number: 12223300
    Abstract: A method of compiling a deep learning model includes reading metadata from a compiled result, the metadata indicating a structure of the deep learning model corresponding to a low-level IR, receiving shape information of an input tensor of the deep learning model, determining a shape of an output tensor of a first computation operation of the computation operations based on the shape information of the input tensor of the deep learning model and the structure of the deep learning model, tiling the output tensor of the first computation operation into one or more tiles according to the shape of the output tensor of the first computation operation and hardware limitations of a processor executing the deep learning model, and patching one or more copies of a templated hardware command into executable hardware commands.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: February 11, 2025
    Assignee: MEDIATEK INC.
    Inventors: Meng-Hsuan Yang, Po-hua Huang, Hsing-Chang Chou, Ting Chen Tsan, Yu-Lung Lu
  • Patent number: 10212985
    Abstract: The present invention is an article of headwear that is conformable so as to accommodate a wide range of head sizes comprised of at least a crown portion that substantially covers the head of the wearer. Proximate the lowest edge of the crown portion is a sweatband or headband permanently affixed thereto that is stretchable in all directions, not just vertically and horizontally. The band is comprised of elastic threads woven into a diamond pattern so that it is capable of stretching and returning substantially to its original shape. In an alternative embodiment of the sweatband, the sweatband comprises a base layer of a flexible material with a plurality of longitudinal bands of fibers with wicking, odor reducing and antibacterial properties superimposed upon the base material of the sweatband.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: February 26, 2019
    Assignee: HEADMOST INTERNATIONAL, INC.
    Inventor: Po Lung Yang
  • Patent number: 8741679
    Abstract: The NH3 plasma treatment by remote plasma is firstly proposed to replace the covalent bonding process during surface modification procedure that for amine bond generation.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: June 3, 2014
    Assignee: Chang Gung University
    Inventors: Chao-Sung Lai, Jau-Song Yu, Yu-Sun Chang, Po-Lung Yang, Tseng-Fu Lu, Yi-Ting Lin, Wen-Yu Chuang, Ting-Chun Yu, I-Shun Wang, Jyh-Ping Chen, Chou Chien
  • Publication number: 20130318686
    Abstract: The present invention is an article of headwear that is adjustable so as to accommodate a wide range of head sizes comprised of at least a crown portion that substantially covers scalp of the wearer. Proximate the lowest edge of the crown portion is a headband permanently affixed thereto that is stretchable in all directions. The headband is comprised of elastic woven into a diamond like pattern so that it is capable of stretching and returning substantially to its original size. The ends of the band may be attached to each other so as to make a complete circumference around the lowest edge of the crown portion of the headgear.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: HEADMOST INTERNATIONAL, INC.
    Inventor: PO LUNG YANG
  • Publication number: 20130247274
    Abstract: The present invention is an article of headwear that is adjustable so as to accommodate a wide range of head sizes comprised of at least a crown portion that substantially covers scalp of the wearer. Proximate the lowest edge of the crown portion is a headband permanently affixed thereto that is stretchable in all directions. The headband is comprised of a ribbon of stretchable rubber that may be fully or partially enclosed within one or more pieces of the same or different strength stretchable material. In all embodiments of the present invention, the ends of the rubber band and stretchable material may be attached so as to make a complete circumference around the lowest edge of the crown portion of the headgear.
    Type: Application
    Filed: March 20, 2012
    Publication date: September 26, 2013
    Applicant: HEADMOST INTERNATIONAL, INC.
    Inventor: PO LUNG YANG
  • Publication number: 20120322167
    Abstract: The NH3 plasma treatment by remote plasma is firstly proposed to replace the covalent bonding process during surface modification procedure that for amine bond generation.
    Type: Application
    Filed: May 8, 2012
    Publication date: December 20, 2012
    Applicant: Chang Gung University
    Inventors: Chao-Sung LAI, Jau-Song Yu, Yu-Sun Chang, Po-Lung Yang, Tseng-Fu Lu, Yi-Ting Lin, Wen-Yu Chuang, Ting-Chun Yu, I-Shun Wang, Jyh-Ping Chen, Chou Chien