Abstract: A fixture for bonding films to an object includes a base, a cavity wall fixed to the base, and a receiving cavity defined by the cavity wall and the base. The cavity wall includes opposing inner and outer surfaces and an end surface at an end away from the base. The end surface defines protrusions interconnecting with recesses and being recessed towards the base. Each recess penetrates the inner surface and the outer surface. A method for employing the device is also provided. The fixture and the method for bonding avoid center wrapping after bonding.

Abstract: A fixture for bonding films to an object includes a base, a cavity wall fixed to the base, and a receiving cavity defined by the cavity wall and the base. The cavity wall includes opposing inner and outer surfaces and an end surface at an end away from the base. The end surface defines protrusions interconnecting with recesses and being recessed towards the base. Each recess penetrates the inner surface and the outer surface. A method for employing the device is also provided. The fixture and the method for bonding avoid center wrapping after bonding.

Abstract: An integrated circuit has an identification circuit for providing a read-only logic value for identifying the integrated circuit. The identification circuit includes a plurality of programmable stages for determining the read-only logic value. Each of the programmable stages includes a logic cell and a conductive path. The logic cell has an input node connected to an input terminal of the programmable stage, an inverting output node, and a non-inverting output node. The logic value at the non-inverting output node is the same as the logic value at the input node, and the logic value at the inverting output node is different from the logic value at the input node. The conductive path is positioned on one of the conductive layers, and is programmed for selectively connecting either one of the inverting output node or the non-inverting output node of the logic cell to an output terminal of the programmable stage.

Abstract: A memory manufactured through a semiconductor process includes a substrate, a memory cell array formed on the substrate, a peripheral circuit formed on the substrate and electrically connected to the memory cell array for controlling access of the memory cell array, and a power distribution network formed substantially above the peripheral circuit or the memory cell array. The power distribution network is electrically connected to the peripheral circuit and the memory cell array for providing power to the peripheral circuit and the memory cell array.