Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact with the first heat spreader. The second heat spreader covers a top surface and sidewalls of the package structure. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A method includes bonding a first package component over a second package component. The second package component includes a plurality of dielectric layers, and a plurality of redistribution lines in the plurality of dielectric layers. The method further includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on the second package component and the stress absorber.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A lens module includes an elongated lens having a first lens, first reflect face formed on a front end thereof. A second lens and a second reflect face are respectively formed on a rear end of the elongated lens. When collecting an image, the light route of the object passes through the first lens and the first reflect face into the elongated lens, and focusing a wrong-reading image. The light route of the wrong-reading image passes through the second reflect face and the second lens and forms a light route that forms a right-reading image on a sensitize unit.

Abstract: The present invention of a controller of contact inductive type using optical principle for controlling a pointer on a display screen includes an optical element, an inbound light source for illuminating the optical element, and a motion transducer for receiving the reflected light from the optical element. The optical element is a lens component having the characteristics of total internal reflection. The optical element having a light source area, the inbound light source enters the optical element through the light source area. An Intensified structure is located on the bottom of the optical element for intensifying the refraction and reflection percentages of the light inside the optical element, in order to utilize the light at a higher ratio. The inbound light source is finally reflected to a contact surface on top of the optical element for placing the portion of the tip of a human digit.