Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

Abstract: A memory operation method, comprising: when a first super block of a memory device is a open block (or in programming state), obtaining a first read count of one of a plurality of first memory blocks in the first super block, wherein the first read count is a number of times that data of one of the first memory blocks is read out; determining whether the first read count is larger than a first threshold; and when the first read count is larger than the first threshold, moving a part of the data in the first super block to a safe area in the memory device, wherein the part of the data comprises data in the first memory block.

Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.

Abstract: A power amplifier includes a power switching circuit, a driver circuit, and an amplifier circuit. The power switching circuit is configured to receive a first voltage and a second voltage, and provide the first voltage or the second voltage according to an operation mode of the power amplifier. The driver circuit is coupled to the power switching circuit. The driver circuit is configured to operate according to the first voltage or the second voltage and generate a driving signal according to an input signal. The amplifier circuit is coupled to the power switching circuit and the driver circuit. The amplifier circuit is configured to operate according to the first voltage or the second voltage and generate an output signal according to the driving signal.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A server includes a chassis, an air duct, a sensing module and a board management controller. The air duct is disposed in the chassis. The sensing module is disposed in the chassis. The sensing module senses whether the air duct is correctly installed. The board management controller is disposed in the chassis and coupled to the sensing module. When the air duct is not correctly installed, the sensing module notifies the board management controller to generate a warning message.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: A transformer includes a magnetic core assembly, a bobbin, two first windings, a second winding and at least one circuit board. The bobbin includes a bobbin main body, a bobbin channel and a winding portion. The winding portion is formed on an outer periphery surface of the bobbin main body. The two first windings are disposed around the winding portion. One of the two first windings is disposed between the other one of the two first windings and the outer periphery surface of the bobbin main body. The second winding is disposed around the winding portion and disposed between the two first windings. The at least one circuit board includes a circuit board hole. The circuit board hole and the bobbin channel are communicated with each other. The magnetic core assembly partially penetrates through the circuit board hole and the bobbin channel.

Abstract: A transformer includes a magnetic core assembly, a bobbin, two first windings, a second winding and a second circuit board. A bobbin channel runs through two opposite sides of the bobbin main body. The winding portion is formed on an outer periphery surface of the bobbin main body. The two first windings are disposed around the winding portion. One of the two first windings is disposed between the other one of the two first windings and the outer periphery surface of the bobbin main body. The second winding is disposed around the winding portion and disposed between the two first windings. The second circuit board hole and the bobbin channel are in communication with each other. The magnetic core assembly partially penetrates through the bobbin channel and the second circuit board hole. The second winding and the second circuit board are connected with each other in parallel.

Abstract: A memory device in an integrated circuit is provided, including an input/output (I/O) circuit, a first memory segment and a second memory segment that separated from the first memory segment in a first direction, a first pair of data lines on a first side of the integrated circuit, extending in the first direction and configured to couple the first memory segment to the I/O circuit, and a second pair of data lines separated from the first pair of data lines in a second direction, different from the first direction, on a second side, opposite to the first side, of the integrated circuit, and configured to couple the second memory segment to the I/O circuit. A first width of the first pair of data lines is different from a second width of the second pair of data lines.

Abstract: The present disclosure describes embodiments of a memory device with a pre-charge circuit. The memory device can include a memory cell, and the pre-charge circuit can include a first transistor and a second transistor. The first transistor includes a first gate terminal, a first source/drain (S/D) terminal coupled to a reference voltage, and a second S/D terminal coupled to a first terminal of the memory cell. The second transistor includes a second gate terminal, a third S/D terminal coupled to the reference voltage, and a fourth S/D terminal coupled to the second terminal of the memory cell. The first and second transistors are configured to pass the reference voltage in response to the control signal being applied to the first and second gate terminals, respectively.

Abstract: A memory device includes a memory array having a plurality of memory cells arranged along a plurality of rows extending in a row direction and a plurality of columns extending in a column direction. The memory array also includes a plurality of write assist cells connected to the plurality of memory cells. At least one write assist cell of the plurality of write assist cells is in each of the plurality of columns and connected to respective ones of the plurality of memory cells in a same column.

Abstract: An integrated circuit includes a first active region of a first set of transistors of a first type, a second active region of a second set of transistors of the first type, a third active region of a third set of transistors of the first type, a fourth active region of a fourth set of transistors of the first type and a fifth active region of a fifth set of transistors of a second type. The first, second, fourth and fifth active region have a first width in a second direction, and are on a first level. The third active region is on the first level, and has a second width different from the first width. The second active region is adjacent to the first boundary, and is separated from the first active region in the second direction. The fourth active region is adjacent to the second boundary.

Abstract: A memory device includes a memory array having a plurality of memory cells arranged along a plurality of rows extending in a row direction and a plurality of columns extending in a column direction. The memory array also includes a plurality of write assist cells connected to the plurality of memory cells. At least one write assist cell of the plurality of write assist cells is in each of the plurality of columns and connected to respective ones of the plurality of memory cells in a same column.

Abstract: A method of forming an integrated circuit includes placing a first cell layout design of the integrated circuit on a layout design, and manufacturing the integrated circuit based on the layout design. Placing the first cell layout design includes placing a first active region layout pattern adjacent to a first cell boundary, placing a second active region layout pattern adjacent to a second cell boundary, and placing a first set of active region layout patterns between the first and second active region layout patterns, according to a first set of guidelines. The first set of guidelines includes selecting transistors of a first type with a first driving strength and transistors of a second type with a second driving strength. In some embodiments, the first, second and first set of active region layout patterns extend in the first direction, and are on a first layout level.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: A memory device includes a memory array having a plurality of memory cells arranged along a plurality of rows extending in a row direction and a plurality of columns extending in a column direction. The memory array also includes a plurality of write assist cells connected to the plurality of memory cells. At least one write assist cell of the plurality of write assist cells is in each of the plurality of columns and connected to respective ones of the plurality of memory cells in a same column.