Patents by Inventor Po-Wei Hu

Po-Wei Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20230154762
    Abstract: A method of forming a semiconductor device is provided. The method includes forming a first film over an active region of a first side of a semiconductor substrate and a second film over a second side of the semiconductor substrate opposing to the first side of the semiconductor substrate; applying a chemical mechanical polishing to remove at least a portion of the second film; after the chemical mechanical polishing, forming a photoresist layer over the first film; and patterning the photoresist layer using an extreme ultraviolet radiation.
    Type: Application
    Filed: May 9, 2022
    Publication date: May 18, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Wei Hu, Po-Chin Nien
  • Patent number: 10261309
    Abstract: A liquid lens chip, a driving apparatus and a driving method thereof are provided. The driving apparatus includes a carrier and a driver. The carrier is configured to carry a liquid lens and has a plurality of electrode pairs in contact with the liquid lens. The driver provides a periodic first driving signal to a selected electrode pair of the electrode pairs during a first time period according to a scan control signal to change a shape of the liquid lens. The driver further provides a periodic second driving signal to an opposite electrode pair opposite to the selected electrode pair during a second time period to recover the shape of the liquid lens which has been changed during the first time period.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 16, 2019
    Assignee: National Tsing Hua University
    Inventors: Fan-Gang Tseng, Pen-Cheng Wang, Po-Wei Hu, Hsien-Lung Ho
  • Publication number: 20180164576
    Abstract: A liquid lens chip, a driving apparatus and a driving method thereof are provided. The driving apparatus includes a carrier and a driver. The carrier is configured to carry a liquid lens and has a plurality of electrode pairs in contact with the liquid lens. The driver provides a periodic first driving signal to a selected electrode pair of the electrode pairs during a first time period according to a scan control signal to change a shape of the liquid lens. The driver further provides a periodic second driving signal to an opposite electrode pair opposite to the selected electrode pair during a second time period to recover the shape of the liquid lens which has been changed during the first time period.
    Type: Application
    Filed: March 31, 2017
    Publication date: June 14, 2018
    Applicant: National Tsing Hua University
    Inventors: Fan-Gang Tseng, Pen-Cheng Wang, Po-Wei Hu, Hsien-Lung Ho