Patents by Inventor Po-Wen Fang

Po-Wen Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250105077
    Abstract: A package-on-package (PoP) structure includes a first package structure and a second package structure stacked on the first package structure. The first package structure includes a die, conductive structures, an encapsulant, and a conductive pattern layer. The conductive structures surround the die. The encapsulant laterally encapsulates the die and the conductive structures. The conductive pattern layer is disposed over and in physical contact with a top surface of the encapsulant and top surfaces of the conductive structures. An entire bottom surface of the conductive pattern layer is located at a same level height, and an entirety of the top surface of the encapsulant and an entirety of the top surfaces of the conductive structures are located at the same level height.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang
  • Patent number: 12219238
    Abstract: An auto framing method is applied to a camera apparatus with an image receiver and a screen. The auto framing method includes receiving a detection image from the image receiver, computing a distance between the image receiver and an identification feature of the detection image, switching a framing mode of the screen into a normal mode or a single mode in accordance with a comparison result of the distance and a predefined distance threshold, setting a preset step count and a preset frame interval to compute a coordinate variation of the identification feature when position difference between a current focus area and a cropping area generated by the framing mode conforms to a predefined difference condition, and utilizing the coordinate variation to acquire an area variation of the cropping area, and scaling the cropping area to a target resolution for displaying on the screen in accordance with the area variation.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: February 4, 2025
    Assignee: Altek Corporation
    Inventors: Po-Wen Fang, Xiu-Hong Bian, Tsung-Hsien Lin
  • Publication number: 20240223881
    Abstract: An auto framing method is applied to a camera apparatus with an image receiver and a screen. The auto framing method includes receiving a detection image from the image receiver, computing a distance between the image receiver and an identification feature of the detection image, switching a framing mode of the screen into a normal mode or a single mode in accordance with a comparison result of the distance and a predefined distance threshold, setting a preset step count and a preset frame interval to compute a coordinate variation of the identification feature when position difference between a current focus area and a cropping area generated by the framing mode conforms to a predefined difference condition, and utilizing the coordinate variation to acquire an area variation of the cropping area, and scaling the cropping area to a target resolution for displaying on the screen in accordance with the area variation.
    Type: Application
    Filed: May 23, 2023
    Publication date: July 4, 2024
    Applicant: Altek Corporation
    Inventors: Po-Wen Fang, Xiu-Hong Bian, Tsung-Hsien Lin
  • Patent number: D1063925
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: February 25, 2025
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Po-Yang Chien, Hao-Jen Fang, Wei-Yi Chang, Chun-Chieh Chen, Chen-Cheng Wang, Chih-Wen Chiang, Sheng-Hung Lee