Abstract: A package structure and a formation method of a package structure are provided. The method includes disposing a semiconductor die over a first surface of a redistribution structure. The method also includes forming a first protective layer to surround a portion of the semiconductor die. The method further includes disposing a device element over a second surface of the redistribution structure. The redistribution structure is between the device element and the semiconductor die. In addition, the method includes forming a second protective layer to surround a portion of the device element. The second protective layer is thicker than the first protective layer, and the second protective layer and the first protective layer have different coefficients of thermal expansion.

Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.

Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.

Abstract: A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.

Abstract: A useful HIV remedy process consists of 4 elements: guinea pig or mouse peritoneal derived adherent macrophages/monocytes as effector cells; cyclophosphamide as an immuno suppressor; chicken RBC as target cells; and the anti-HIV1 agent candidate to be examined. Immunovir and components were isolated from Pyrus serotina Rehder and other species of Rosaceae by column chromatography.

Abstract: An electromagnetic shielding film includes an insulation layer, and an electromagnetic shielding layer arranged at one side of the insulation layer. The electromagnetic shielding layer includes a polymer substrate and an electromagnetic shielding material. The polymer substrate has epoxy structures. The electromagnetic shielding material has a plurality of aculeate electromagnetic shielding microparticles dispersed in the polymer substrate.

Abstract: A composite optical film is provided. The composite optical film sequentially includes a substrate, a light diffusion layer, and a light-gathering layer. The light diffusion layer includes a binder and plural micro beads dispersed therein. The thickness of the light diffusion layer is 2-6 times of the average diameter of the micro beads, and the distance between adjacent micro beads is smaller than the average diameter of the micro beads. The light-gathering layer has plural light-gathering micro structures.

Abstract: A composite optical film is provided. The composite optical film sequentially includes a substrate, a light diffusion layer, and a light-gathering layer. The light diffusion layer includes a binder and plural micro beads dispersed therein. The thickness of the light diffusion layer is 2-6 times of the average diameter of the micro beads, and the distance between adjacent micro beads is smaller than the average diameter of the micro beads. The light-gathering layer has plural light-gathering micro structures.

Abstract: The present invention provides an optical element, which comprises: (a) a substrate, (b) a first surface on one side of the substrate wherein said first surface comprises a plurality of prism columnar structures with rounded peaks and the curvature radii of the rounded peaks are in the range from 3 ?m to 20 ?m, and (c) a second surface on the other side of the substrate wherein the second surface can be a plane surface or with concave-convex structures.

Abstract: The present invention relates to a composite optical film, which comprises a substrate having diffusion micro-structures and a structured surface on one side of the substrate wherein said composite optical film has an internal diffusion haze of no less than 5% as measured according to JIS K7136 standard method. The composite optical film of the present invention has both light-diffusion and light-converging properties. The composite optical film of the present invention, when utilized in a liquid crystal display (LCD), can not only effectively enhance the luminance of the LCD panel but also avoid light dispersion and Moiré phenomena that may occur when said composite optical film is stacked with other material films.

Abstract: The present invention provides a polymerizable composition, which comprises: (a) at least one monomer of formula (I): (b) a photo-initiator, wherein X1, X2, Y1, Y2, Y3, Y4, a, and b are as defined in the specification and the amount of the monomer of formula (I) is at least 1 wt %, based on the total weight of the polymerizable composition. The present invention also provides an optical film comprising a coating layer formed from the above polymerizable composition. The optical film can be used in backlight modules of displays as a brightness enhancement film.

Abstract: A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.

Abstract: A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.