Patents by Inventor Po-Wen Shih

Po-Wen Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150191289
    Abstract: A packing buffer material of a radiator tank is fixed on one of four end edges of a radiator tank and contains a first end portion, a second end portion, and a buffer end portion. The first end portion has two extending fences formed on an upper end and a lower end thereof, and between the two extending fences is defined a flexible fitting groove. The second end portion has a plurality of toothed sheets extending downwardly from a long outer wall of an extending fence on the lower end of the first end portion, and between any two adjacent toothed sheets is defined a flexible clamping opening. The buffer end portion has a curved rib formed on one side of a top surface of the first end portion. Thereby, the packing buffer material positions and packages the radiator tank in a carton easily.
    Type: Application
    Filed: January 6, 2014
    Publication date: July 9, 2015
    Inventors: Po-Wen Shih, Chia-Liang Liu
  • Patent number: 8905084
    Abstract: A tube of a radiator includes a tube body, and a reinforcement strip. The tube body has a first curved face and a second curved face. The tube body is formed by a sheet plate which has two opposite ends connected to form a connecting portion which is located at the first curved face of the tube body. The reinforcement strip is mounted in the sheet plate and is located at the second curved face of the tube body. Thus, the first curved face of the tube body is formed with the connecting portion, and the second curved face of the tube body is combined with the reinforcement strip so that both of the first curved face and the second curved face of the tube body have a larger thickness to enhance the stiffness and strength of the tube body.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: December 9, 2014
    Assignee: Cryomax Cooling System Corp.
    Inventor: Po-Wen Shih
  • Publication number: 20140158248
    Abstract: A tube of a radiator includes a tube body, and a reinforcement strip. The tube body has a first curved face and a second curved face. The tube body is formed by a sheet plate which has two opposite ends connected to form a connecting portion which is located at the first curved face of the tube body. The reinforcement strip is mounted in the sheet plate and is located at the second curved face of the tube body. Thus, the first curved face of the tube body is formed with the connecting portion, and the second curved face of the tube body is combined with the reinforcement strip so that both of the first curved face and the second curved face of the tube body have a larger thickness to enhance the stiffness and strength of the tube body.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 12, 2014
    Inventor: Po-Wen Shih
  • Publication number: 20110312204
    Abstract: A connector module and a connector are provided. The connector module includes a first connecting unit and a second connecting unit. The first connecting unit is disposed at a motherboard. The first connecting unit includes a plurality of pins, a plurality of slots and a fastener. The pins are disposed in the slots correspondingly. A plane joint surface and a curved guiding surface are formed at the fastener. The second connecting unit includes a fastening hook. When the first connecting unit and the second connecting unit are connected, the connecting surface contacts the fastening hook.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 22, 2011
    Inventors: Po-Wen SHIH, Hsin-Yi CHEN
  • Patent number: 8059403
    Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: November 15, 2011
    Assignee: ASUSTeK Computer Inc.
    Inventors: Chia-Hsing Chou, Po-Wen Shih, Shang-Yi Wang
  • Publication number: 20100188817
    Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.
    Type: Application
    Filed: January 6, 2010
    Publication date: July 29, 2010
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chia-Hsing Chou, Po-Wen Shih, Shang-Yi Wang
  • Patent number: D597966
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: August 11, 2009
    Assignee: ASUSTeK Computer Inc.
    Inventor: Po-Wen Shih
  • Patent number: D686578
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: July 23, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Po-Wen Shih, Hsin-Yi Chen
  • Patent number: D879273
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: March 24, 2020
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventor: Po Wen Shih