Abstract: A semiconductor structure includes: a substrate; a package attached to a first surface of the substrate, where the package includes: an interposer, where a first side of the interposer is bonded to the first surface of the substrate through first conductive bumps; dies attached to a second side of the interposer opposing the first side; and a molding material on the second side of the interposer around the dies; a plurality of thermal interface material (TIM) films on a first surface of the package distal from the substrate, where each of the TIM films is disposed directly over at least one respective die of the dies; and a heat-dissipation lid attached to the first surface of the substrate, where the package and the plurality of TIM films are disposed in an enclosed space between the heat-dissipation lid and the substrate, where the heat-dissipation lid contacts the plurality of TIM films.

Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate and a semiconductor device disposed over the package substrate. A ring structure is disposed over the package substrate and laterally surrounds the semiconductor device. The ring structure includes a lower ring portion arranged around the periphery of the package substrate. Multiple notches are formed along the outer periphery of the lower ring portion. The ring structure also includes an upper ring portion formed on the lower ring portion. The upper ring portion laterally extends toward the semiconductor device, so that the inner periphery of the upper ring portion is closer to the semiconductor device than the inner periphery of the lower ring portion. An adhesive layer is interposed between the lower ring portion and the package substrate.

Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate and a semiconductor device disposed over the package substrate. A ring structure is disposed over the package substrate and laterally surrounds the semiconductor device. The ring structure includes a lower ring portion arranged around the periphery of the package substrate. Multiple notches are formed along the outer periphery of the lower ring portion. The ring structure also includes an upper ring portion integrally formed on the lower ring portion. The upper ring portion laterally extends toward the semiconductor device, so that the inner periphery of the upper ring portion is closer to the semiconductor device than the inner periphery of the lower ring portion. An adhesive layer is interposed between the lower ring portion and the package substrate.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: An athletic shoe includes an upper section and a sole section. The upper section is attached to the sole section. The upper section includes at least a wearing opening. The sole section includes a bottom portion, a support portion, and a receiving portion. The support portion is arranged between the bottom portion and the receiving portion and extends from a shoe heel portion of the sole section toward a shoe sole portion of the sole section. The receiving portion includes a first trough, a second trough, and a third trough formed therein. The first trough receives therein a first soft pad that corresponds in shape thereto. The second trough receives therein a second soft pad that corresponds in shape thereto. The third trough receives therein a third soft pad that corresponds in shape thereto. As such, the sole section is provided with a plurality of rush stop sites.

Abstract: A high-heeled shoe includes an upper that is attached to the midsole and has a wearing opening. A midsole includes a midsole bed having a posterior portion that is recessed to form a first trough and a front pad that is mounted to an anterior portion of the midsole bed and is recessed to form a second trough and a third trough. A bottom support board is attached to a bottom surface of the midsole and includes an anterior end portion and a posterior end portion. The anterior end portion of the bottom support board is mounted to the bottom surface of the midsole in such a way as to partially overlap the front pad located on the midsole. A shoe heel is mounted to the posterior end portion of the bottom support board.

Abstract: A high-heeled shoe includes an upper that is attached to the midsole and has a wearing opening. A midsole includes a midsole bed having a posterior portion that is recessed to form a first trough and a front pad that is mounted to an anterior portion of the midsole bed and is recessed to form a second trough and a third trough. A bottom support board is attached to a bottom surface of the midsole and includes an anterior end portion and a posterior end portion. The anterior end portion of the bottom support board is mounted to the bottom surface of the midsole in such a way as to partially overlap the front pad located on the midsole. A shoe heel is mounted to the posterior end portion of the bottom support board.

Abstract: An athletic shoe includes an upper section and a sole section. The upper section is attached to the sole section. The upper section includes at least a wearing opening. The sole section includes a bottom portion, a support portion, and a receiving portion. The support portion is arranged between the bottom portion and the receiving portion and extends from a shoe heel portion of the sole section toward a shoe sole portion of the sole section. The receiving portion includes a first trough, a second trough, and a third trough formed therein. The first trough receives therein a first soft pad that corresponds in shape thereto. The second trough receives therein a second soft pad that corresponds in shape thereto. The third trough receives therein a third soft pad that corresponds in shape thereto. As such, the sole section is provided with a plurality of rush stop sites.

Abstract: A platform shoe includes an upper, a midsole, and an outsole. The upper is attached to the midsole and has a wearing opening. The midsole is attached to the outsole and includes a midsole bed and a front pad. The midsole bed has a posterior portion that is recessed to form a first trough. The front pad is mounted to an anterior portion of the midsole bed and is recessed to form a second trough and a third trough. The outsole includes a supportive section, a bottom section, and a shoe heel. The supportive section has a posterior portion to which the shoe heel is fixed. The bottom section is provided at an underside of the supportive section and the shoe heel. The bottom section has an anterior portion on which the bottom platform is formed. The troughs each receive and retain therein a corresponding soft pad.