Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.

Abstract: A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.

Abstract: An athletic shoe includes an upper section and a sole section. The upper section is attached to the sole section. The upper section includes at least a wearing opening. The sole section includes a bottom portion, a support portion, and a receiving portion. The support portion is arranged between the bottom portion and the receiving portion and extends from a shoe heel portion of the sole section toward a shoe sole portion of the sole section. The receiving portion includes a first trough, a second trough, and a third trough formed therein. The first trough receives therein a first soft pad that corresponds in shape thereto. The second trough receives therein a second soft pad that corresponds in shape thereto. The third trough receives therein a third soft pad that corresponds in shape thereto. As such, the sole section is provided with a plurality of rush stop sites.

Abstract: A high-heeled shoe includes an upper that is attached to the midsole and has a wearing opening. A midsole includes a midsole bed having a posterior portion that is recessed to form a first trough and a front pad that is mounted to an anterior portion of the midsole bed and is recessed to form a second trough and a third trough. A bottom support board is attached to a bottom surface of the midsole and includes an anterior end portion and a posterior end portion. The anterior end portion of the bottom support board is mounted to the bottom surface of the midsole in such a way as to partially overlap the front pad located on the midsole. A shoe heel is mounted to the posterior end portion of the bottom support board.

Abstract: A high-heeled shoe includes an upper that is attached to the midsole and has a wearing opening. A midsole includes a midsole bed having a posterior portion that is recessed to form a first trough and a front pad that is mounted to an anterior portion of the midsole bed and is recessed to form a second trough and a third trough. A bottom support board is attached to a bottom surface of the midsole and includes an anterior end portion and a posterior end portion. The anterior end portion of the bottom support board is mounted to the bottom surface of the midsole in such a way as to partially overlap the front pad located on the midsole. A shoe heel is mounted to the posterior end portion of the bottom support board.

Abstract: An athletic shoe includes an upper section and a sole section. The upper section is attached to the sole section. The upper section includes at least a wearing opening. The sole section includes a bottom portion, a support portion, and a receiving portion. The support portion is arranged between the bottom portion and the receiving portion and extends from a shoe heel portion of the sole section toward a shoe sole portion of the sole section. The receiving portion includes a first trough, a second trough, and a third trough formed therein. The first trough receives therein a first soft pad that corresponds in shape thereto. The second trough receives therein a second soft pad that corresponds in shape thereto. The third trough receives therein a third soft pad that corresponds in shape thereto. As such, the sole section is provided with a plurality of rush stop sites.

Abstract: A platform shoe includes an upper, a midsole, and an outsole. The upper is attached to the midsole and has a wearing opening. The midsole is attached to the outsole and includes a midsole bed and a front pad. The midsole bed has a posterior portion that is recessed to form a first trough. The front pad is mounted to an anterior portion of the midsole bed and is recessed to form a second trough and a third trough. The outsole includes a supportive section, a bottom section, and a shoe heel. The supportive section has a posterior portion to which the shoe heel is fixed. The bottom section is provided at an underside of the supportive section and the shoe heel. The bottom section has an anterior portion on which the bottom platform is formed. The troughs each receive and retain therein a corresponding soft pad.