Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A training device and a training method for a neural network model. The training method includes: obtaining a data set; completing, according to the data set, a plurality of artificial intelligence (AI) model trainings to generate a plurality of models corresponding to the plurality of AI model trainings respectively; selecting, according to a first constraint, a first model set from the plurality of models; and selecting, according to a second constraint, the neural network model from the first model set.

Abstract: A training device and a training method for a neural network model are provided. The training method includes: obtaining a data set; completing, according to the data set, a plurality of artificial intelligence (AI) model trainings to generate a plurality of models corresponding to the plurality of AI model trainings respectively; selecting, according to a first constraint, a first model set from the plurality of models; and selecting, according to a second constraint, the neural network model from the first model set.