Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A nitrogen-containing porous carbon material, and a capacitor and a manufacturing method thereof are provided. A carbon material, a macromolecular material and a modified material are mixed into a preform. The modified material includes nitrogen. A formation process is performed on the preform to obtain a formed object. High-temperature sintering is performed on the formed object to decompose and remove a part of the macromolecular material, while the other part of the macromolecular material and the carbon material together form a backbone structure including a plurality of pores. As such, the nitrogen becomes attached to the backbone structure to form a hydrogen-containing functional group to further obtain the nitrogen-containing porous carbon material. The nitrogen-containing porous carbon material may form a first nitrogen-containing porous carbon plate and a second nitrogen-containing porous carbon plate, which are placed in seawater to form a storage capacitor for seawater.