Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An etch stop layer is formed on the sacrificial substrate. A portion of the etch stop layer is oxidized to form an oxide layer between the sacrificial substrate and the remaining etch stop layer. A capping layer is formed on the remaining etch stop layer. A device layer is formed on the capping layer. A first etching process is performed to remove the sacrificial substrate. A second etching process is performed to remove the oxide layer. A third etching process is performed to remove the remaining etch stop layer. A power rail is formed on the capping layer opposite to the device layer.

Abstract: A LED display structure and its display module thereof are provided. The LED display module includes a LED array, a substrate disposed below the LED array, and at least one trace configuration layer, which is disposed below the LED array and adjacent to the substrate. The at least one trace configuration layer includes a plurality of wires, and a distribution density of the wires varies according to a distance between the wires and the LED array. When the distance increases, the distribution density of the wires is denser. Otherwise, the distribution density is sparse when the wires are closer to the LED array. In view of the simulation experimental analyses of the present invention, it is believed that at least 30% of the stray light ratio can be reduced so as to enhance the LED display structure with better transparency and image quality.

Abstract: The present disclosure provides a pixel circuit with pulse width compensation, and the pixel circuit includes a pulse width modulation circuit and a pulse amplitude modulation circuit, and the pulse amplitude modulation circuit is electrically connected to the pulse width modulation circuit. The pulse width modulation circuit includes a P-type pulse width compensation transistor and a first P-type control transistor, and the first P-type control transistor is electrically connected to the P-type pulse width compensation transistor. The pulse amplitude modulation circuit includes a second P-type control transistor, a first capacitor, a P-type driving transistor and a light-emitting element. The second P-type control transistor is electrically connected to the first P-type control transistor. The first capacitor is electrically connected to the second P-type control transistor.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.

Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.

Abstract: An electronic device includes a host, a display, a sliding plate, and a keyboard. The host has an operating surface. The display is pivoted to the host. The sliding plate is slidably disposed in the host, where the display is mechanically coupled to the sliding plate, and the sliding plate includes a plat portion and a recess portion that are arranged side by side. The keyboard is integrated to the host. The keyboard includes a key structure, where the key structure includes a key cap and a reciprocating element, and the key cap is exposed from the operating surface of the host. The reciprocating element is disposed between the key cap and the sliding plate and has a first end connected to the key cap and a second end contacting the sliding plate. The second end is located on a sliding path of the plat portion and the recess portion.

Abstract: A coaxial cable connector detachably jackets a coaxial cable. The coaxial cable connector includes a metal sleeve, a clamping sleeve, a coupling sleeve, and an internal conductive ring. The clamping sleeve is connected to a first end portion of a main body of the metal sleeve for being squeezed to deform radially to tightly clamp the coaxial cable. The coupling sleeve is disposed at a second end portion of the main body. The internal conductive ring is disposed in a ring containing space of the main body. When the main body jackets the coaxial cable, the metal sleeve is in contact with an external surface of a metal layer of the coaxial cable via the internal conductive ring but not in contact with an internal surface of the metal layer to establish electrical connection between the metal sleeve and the metal layer.

Abstract: The invention provides a gate driving circuit and a display apparatus. The gate driving circuit includes 1st to Nth stage shift registers for respectively generating and sequentially outputting 1st to Nth stage scan signals to the display panel, where N is an integer greater than or equal to 4. Each of the shift registers is configured to receive a starting signal, and the starting signal is utilized to trigger the 1st and 2nd stage shift registers to generate the 1st and 2nd stage scan signals respectively, and the starting signal is utilized to reset the 3rd to Nth stage shift registers.

Abstract: The invention provides a gate driving circuit and a display device. The gate driving circuit is configured to drive a display panel of the display device, and includes shift registers and at least a dummy shift register. The shift registers are respectively configured to generate and output scan signals to scan lines of the display panel, the dummy shift register is configured to generate a dummy scan signal before the scan signals are generated. The dummy scan signal and the scan signals are sequentially generated.

Abstract: The invention provides a gate driving circuit and a display device. The gate driving circuit is configured to drive a display panel of the display device, and includes shift registers and at least a dummy shift register. The shift registers are respectively configured to generate and output scan signals to scan lines of the display panel, the dummy shift register is configured to generate a dummy scan signal before the scan signals are generated. The dummy scan signal and the scan signals are sequentially generated.

Abstract: The invention provides a gate driving circuit and a display device. The gate driving circuit is configured to drive a display panel of the display device, and includes shift registers and at least a dummy shift register. The shift registers are respectively configured to generate and output scan signals to scan lines of the display panel, the dummy shift register is configured to generate a dummy scan signal before the scan signals are generated. The dummy scan signal and the scan signals are sequentially generated.

Abstract: The invention provides a gate driving circuit and a display apparatus. The gate driving circuit includes 1st to Nth stage shift registers for respectively generating and sequentially outputting 1st to Nth stage scan signals to the display panel, where N is an integer greater than or equal to 4. Each of the shift registers is configured to receive a starting signal, and the starting signal is utilized to trigger the 1st and 2nd stage shift registers to generate the 1st and 2nd stage scan signals respectively, and the starting signal is utilized to reset the 3rd to Nth stage shift registers.

Abstract: The invention provides a gate driving circuit and a display device. The gate driving circuit is configured to drive a display panel of the display device, and includes shift registers and at least a dummy shift register. The shift registers are respectively configured to generate and output scan signals to scan lines of the display panel, the dummy shift register is configured to generate a dummy scan signal before the scan signals are generated. The dummy scan signal and the scan signals are sequentially generated.

Abstract: A test system for testing an electronic device is disclosed. The test system includes a signal generator for generating an input signal, a signal splitter for splitting the input signal into a first splitting signal and a second splitting signal, a micro control unit for generating a first control signal and a second control signal, a first transmission interface for transmitting the first splitting signal and the first control signal, a second transmission interface for transmitting the second splitting signal and the second control signal, and a first signal adjustment unit for transforming the first splitting signal to a first test signal for test according to the first control signal.