Abstract: A LED display structure and its display module thereof are provided. The LED display module includes a LED array, a substrate disposed below the LED array, and at least one trace configuration layer, which is disposed below the LED array and adjacent to the substrate. The at least one trace configuration layer includes a plurality of wires, and a distribution density of the wires varies according to a distance between the wires and the LED array. When the distance increases, the distribution density of the wires is denser. Otherwise, the distribution density is sparse when the wires are closer to the LED array. In view of the simulation experimental analyses of the present invention, it is believed that at least 30% of the stray light ratio can be reduced so as to enhance the LED display structure with better transparency and image quality.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.

Abstract: A dock for an electronic device is in capable of keeping conductive contacts within the dock until the electronic device is inserted into the dock. Furthermore, collision between an insertion portion of the electronic device and the conductive contacts can be avoided in the process of inserting the electronic device into the dock or removing the electronic device from the dock, so as to prevent the conductive contacts or the surface of the electronic device from being damaged. An electronic device assembly having the aforementioned dock is also provided.

Abstract: A dock for an electronic device is in capable of keeping conductive contacts within the dock until the electronic device is inserted into the dock. Furthermore, collision between an insertion portion of the electronic device and the conductive contacts can be avoided in the process of inserting the electronic device into the dock or removing the electronic device from the dock, so as to prevent the conductive contacts or the surface of the electronic device from being damaged. An electronic device assembly having the aforementioned dock is also provided.