Patents by Inventor Po-Yi Huang

Po-Yi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12216407
    Abstract: A multi-spray RRC process with dynamic control to improve final yield and further reduce resist cost is disclosed. In one embodiment, a method, includes: dispensing a first layer of solvent on a semiconductor substrate while spinning at a first speed for a first time period; dispensing the solvent on the semiconductor substrate while spinning at a second speed for a second time period so as to transform the first layer to a second layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a third speed for a third time period so as to transform the second layer to a third layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a fourth speed for a fourth time period so as to transform the third layer to a fourth layer of the solvent; and dispensing a first layer of photoresist on the fourth layer of the solvent while spinning at a fifth speed for a fifth period of time.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hsuan Chuang, Po-Sheng Lu, Shou-Wen Kuo, Cheng-Yi Huang, Chia-Hung Chu
  • Patent number: 12204135
    Abstract: A backlit-module-embedded illuminated keyswitch structure includes a baseplate, a mask film disposed below the baseplate and having a first coating configured to substantially reflect a light, a light guide sheet disposed at one side of the mask film and having a light source hole, a reflective layer disposed at one side of the light guide sheet opposite to the mask film and having an opening communicating with the light source hole, a top glue configured to connect the mask film and the light guide sheet around the light source hole, and a bottom glue configured to connect the light guide sheet and the reflective layer around the light source hole. The first coating covers the light source hole. In a stacked direction of the mask film, the light guide sheet, and the reflective layer, at least one of the top glue and the bottom glue overlaps the first coating.
    Type: Grant
    Filed: March 1, 2024
    Date of Patent: January 21, 2025
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Po-Yueh Chou
  • Patent number: 11767504
    Abstract: Disclosed herein are albumin compositions having defined fatty acid profiles and methods of using the same. The albumin compositions described herein are suitable for use in cell culture methods, protein stabilization methods, amongst others. The albumin compositions described herein may improve the viability of and/or promote the growth of cells (e.g., mammalian cells) when the cells are cultured in a medium containing the albumin compositions. The albumin compositions described herein may improve the stability of a biologic when the biologic is in the presence of the albumin compositions. Further provided herein are methods of formulating albumin compositions having defined fatty acid profiles as described herein.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: September 26, 2023
    Assignee: Albcura Corporation
    Inventors: Po-Yi Huang, Meng-Tsung Hsu, Pei-Chin Chen, Yu-Feng Liang, Chen-Yu Hsieh, Jeffy Chern
  • Patent number: 11746349
    Abstract: Methods and compositions of altering a eukaryotic cell are described including providing to the eukaryotic cell a guide DNA sequence complementary to a target nucleic acid sequence, providing to the eukaryotic cell an Ago enzyme or a nuclease null Ago protein that interacts with the guide DNA sequence for DNA-guided gene editing and regulation of the target nucleic acid sequence in a site specific manner.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: September 5, 2023
    Assignee: President and Fellows of Harvard College
    Inventors: George M. Church, Luhan Yang, Margo R. Monroe, Po-Yi Huang
  • Patent number: 11685942
    Abstract: A method of making a polypeptide including one or more D-amino acids is provided. The method includes combining a ribosome with protein translation factors including (1) a template encoding the polypeptide, wherein the template encoding the polypeptide includes one or more codons which have been recoded to accept a tRNA attached to a D-amino acid, (2) a plurality of L-amino acids and a plurality of corresponding tRNAs, (3) a plurality of D-amino acids and their corresponding aminoacyl tRNA synthetase or a plurality of tRNAs ligated with a D-amino acid, and (4) elongation factor P in a concentration of 2 to 20 micromolar, wherein translation of the template encoding the polypeptide occurs to produce the polypeptide including one or more D-amino acids.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: June 27, 2023
    Assignee: President and Fellows of Harvard College
    Inventors: George M. Church, Po-Yi Huang
  • Publication number: 20220048976
    Abstract: Disclosed herein are albumin compositions having defined fatty acid profiles and methods of using the same. The albumin compositions described herein are suitable for use in cell culture methods, protein stabilization methods, amongst others. The albumin compositions described herein may improve the viability of and/or promote the growth of cells (e.g., mammalian cells) when the cells are cultured in a medium containing the albumin compositions. The albumin compositions described herein may improve the stability of a biologic when the biologic is in the presence of the albumin compositions. Further provided herein are methods of formulating albumin compositions having defined fatty acid profiles as described herein.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 17, 2022
    Inventors: Po-Yi Huang, Meng-Tsung Hsu, Pei-Chin Chen, Yu-Feng Liang, Chen-Yu Hsieh, Jeffy Chern
  • Publication number: 20210189388
    Abstract: Methods and compositions of altering a eukaryotic cell are described including providing to the eukaryotic cell a guide DNA sequence complementary to a target nucleic acid sequence, providing to the eukaryotic cell an Ago enzyme or a nuclease null Ago protein that interacts with the guide DNA sequence for DNA-guided gene editing and regulation of the target nucleic acid sequence in a site specific manner.
    Type: Application
    Filed: February 7, 2017
    Publication date: June 24, 2021
    Applicants: President and Fellows of Harvard College, President and Fellows of Harvard College
    Inventors: George M. Church, Luhan Yang, Margo R. Monroe, Po-Yi Huang
  • Publication number: 20200283817
    Abstract: A method of making a polypeptide including one or more D-amino acids is provided that includes the use of elongation factor P with translational machinery.
    Type: Application
    Filed: March 3, 2017
    Publication date: September 10, 2020
    Inventors: George M. Church, Po-Yi Huang
  • Patent number: 9759745
    Abstract: In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: September 12, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yung-Hsin Kuo, Yuan-Li Lin, Po-Yi Huang
  • Patent number: 9261534
    Abstract: Among other things, one or more techniques and/or systems are provided for shielding a signal pin. A signal pin, such as a signal pin within a probe card used to test electronic devices, such as integrated circuits, is shielded from interference signals, which are emitted from other signal pins within the probe card. Shielding the signal pin mitigates cross-talk issues and/or impendence control issues associated with signals that are carried by the signal pin. In one example, one or more shield pins are arranged with respect to the signal pin according to a shield configuration. For example, the shield configuration comprises a plane of signal pins, a substantially regular layout of signal pins, or a polygonal layout of signal pins, etc. In this way, one or more shield pins inhibit unintended interactions or effects that otherwise occur among two or more signal pins.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: February 16, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yung-Hsin Kuo, Po-Yi Huang
  • Publication number: 20150309074
    Abstract: In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 29, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: YUNG-HSIN KUO, YUAN-LI LIN, PO-YI HUANG
  • Patent number: 9134368
    Abstract: Some embodiments relate to an integrated circuit. The integrated circuit includes an inductive or capacitive wireless communication structure located on a die region of the integrated circuit. This wireless communication structure is configured to wirelessly receive a test stimulus vector to test circuitry on the die region. The integrated circuit also includes a landing region having a size and location suitable to allow a conductive needle or conductive probe to come into direct physical and electrical contact with the landing region. The landing region provides a DC power supply to the circuitry on the die region while the test stimulus vector is wirelessly received.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: September 15, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsin Kuo, Po-Yi Huang
  • Publication number: 20140028338
    Abstract: Among other things, one or more techniques and/or systems are provided for shielding a signal pin. A signal pin, such as a signal pin within a probe card used to test electronic devices, such as integrated circuits, is shielded from interference signals, which are emitted from other signal pins within the probe card. Shielding the signal pin mitigates cross-talk issues and/or impendence control issues associated with signals that are carried by the signal pin. In one example, one or more shield pins are arranged with respect to the signal pin according to a shield configuration. For example, the shield configuration comprises a plane of signal pins, a substantially regular layout of signal pins, or a polygonal layout of signal pins, etc. In this way, one or more shield pins inhibit unintended interactions or effects that otherwise occur among two or more signal pins.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 30, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yung-Hsin Kuo, Po-Yi Huang
  • Publication number: 20130293253
    Abstract: Some embodiments relate to an integrated circuit. The integrated circuit includes an inductive or capacitive wireless communication structure located on a die region of the integrated circuit. This wireless communication structure is configured to wirelessly receive a test stimulus vector to test circuitry on the die region. The integrated circuit also includes a landing region having a size and location suitable to allow a conductive needle or conductive probe to come into direct physical and electrical contact with the landing region. The landing region provides a DC power supply to the circuitry on the die region while the test stimulus vector is wirelessly received.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 7, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsin Kuo, Po-Yi Huang