Patents by Inventor Po-Yin Chen

Po-Yin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081572
    Abstract: A semiconductor device structure and methods of forming the same are described. The structure includes a first semiconductor material disposed over a substrate and a dielectric layer disposed on the first semiconductor material. The dielectric layer includes a dopant. The structure further includes a second semiconductor material disposed on the dielectric layer, a first semiconductor layer in contact with the second semiconductor material, and a first dielectric spacer in contact with the first semiconductor layer, wherein the first dielectric spacer includes the dopant.
    Type: Application
    Filed: January 3, 2024
    Publication date: March 6, 2025
    Inventors: Yu-Chang LIN, Po-Kang HO, Liang-Yin CHEN, Tsai-Yu HUANG, Chi On CHUI
  • Patent number: 11744762
    Abstract: A gait activity learning assistance system, and an application method thereof, includes a main body, at least one movement detecting module, a control module, at least one driving module and at least one dynamic measurement module. The system is able to guide and induce a user to learn gait autonomously by disposing at least one force-transmission unit on at least one limb position of the user, besides, the system is able to measure a dynamic change of the at least one force-transmission unit by the at least one dynamic measurement module while user receiving a gait assistance, and send them back to the control module immediately for a real-time analysis.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: September 5, 2023
    Assignee: National Yang Ming Chiao Tung University
    Inventors: Chung-Huang Yu, Fu-Cheng Wang, Po-Yin Chen, Hsiao-Kuan Wu, Yu-You Lin, Kai-Lin Wu
  • Publication number: 20200030176
    Abstract: The present application provides a gait activity learning assistance system and the application method thereof, which comprising a main body, at least one movement detecting module, a control module, at least one driving module and at least one dynamic measurement module. Said system is able to guide and induce users to learn gait autonomously by disposed at least one interlocking unit on at least one limb position, besides, said system is able to measure a dynamic change of at least one the interlocking unit by the at least one dynamic measurement module while user receiving a gait assistance, and send them back to the control module immediately for a real time analysis; therefore, said system could regulate the operation parameter to simulate the rehabilitation of physical therapists.
    Type: Application
    Filed: May 23, 2019
    Publication date: January 30, 2020
    Inventors: CHUNG-HUANG YU, FU-CHENG WANG, PO-YIN CHEN, HSIAO-KUAN WU, YU-YOU LIN, KAI-LIN WU
  • Publication number: 20180206773
    Abstract: The present application provides a dynamic assessment and rehabilitation system for vertigo patients and the application method thereof, which uses a moveable monitoring platform to monitor and test a walking user and coordinates a first wearing unit to observe the head-turning condition to ensure the operating intensity of the user, in additional, by disposing a terminal module capable of recording the using condition of the user and analyzing and calculating the signals generated during the test process. In accordance with aforesaid system, the physiologic status of a vertigo patient can be assessed in a walking status and the patient can be given a feedback corresponding thereto, therefore raising the using efficiency of the user.
    Type: Application
    Filed: August 30, 2017
    Publication date: July 26, 2018
    Inventors: Chung-Huang YU, Po-Yin CHEN, Li-Wei CHOU, Chung-Lan KAO, Yi-Shun CHUNG
  • Publication number: 20070262121
    Abstract: A method for soldering an electronic component to a substrate is provided. The method includes the steps of forming a metal layer on the substrate; applying a solder material on the metal layer; and performing a thermal process to transfer the solder material into a solder joint so as to connect the electronic component with the substrate. During the thermal process, a portion of the metal layer is introduced into the solder joint, thereby elevating the eutectoid temperature of the solder joint. This invention also provides an electronic device made by this method.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 15, 2007
    Inventors: Sinn-Wen Chen, Chao-Hong Wang, Po-Yin Chen, Zhien-Chi Chen
  • Patent number: D868018
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: November 26, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Po-Yin Chen, Yuan-Shie Chang, Chih-Yu Chen
  • Patent number: D900935
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: November 3, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Wen Lo, Po-Yin Chen, Yuan-Shie Chang