Patents by Inventor Po Yu Feng

Po Yu Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with pad to pad bonding
    Patent number: 7952209
    Abstract: An integrated circuit package system includes an integrated circuit die, a first controlled bump over the integrated circuit die, a second controlled bump over the integrated circuit die, and a connector between the first controlled bump and the second controlled bump.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: May 31, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Po Yu Feng, Cheng Yu Hsia
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PAD TO PAD BONDING
    Publication number: 20080079173
    Abstract: An integrated circuit package system includes an integrated circuit die, a first controlled bump over the integrated circuit die, a second controlled bump over the integrated circuit die, and a connector between the first controlled bump and the second controlled bump.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 3, 2008
    Applicant: STATS CHIPPAC LTD.
    Inventors: Po Yu Feng, Cheng Yu Hsia