Patents by Inventor Po-Yuan Cheng
Po-Yuan Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132330Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Huan-Chang CHEN, Po-Jen KO, Chun-Ju WU, Lon-Jay CHENG, Wan-Ping CHEN, Chih-Yuan CHANG
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Patent number: 11961808Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: GrantFiled: October 14, 2021Date of Patent: April 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
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Publication number: 20240105619Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.Type: ApplicationFiled: November 29, 2023Publication date: March 28, 2024Inventors: Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu, Yi-Kan Cheng
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Patent number: 11923302Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.Type: GrantFiled: June 30, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu, Yi-Kan Cheng
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Patent number: 11869822Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.Type: GrantFiled: July 23, 2021Date of Patent: January 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
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Publication number: 20230290704Abstract: A package structure includes first and second package components, an underfill layer disposed between the first and second package components, and a metallic layer. The first package component includes semiconductor dies, a first insulating encapsulation laterally encapsulating the semiconductor dies, and a redistribution structure underlying first surfaces of the semiconductor dies and the first insulating encapsulation. The second package component underlying the first package component is electrically coupled to the semiconductor dies through the redistribution structure. The underfill layer extends to cover a sidewall of the first package component, the metallic layer overlying second surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the second surface of the first insulating encapsulation is accessibly exposed by the metallic layer, where the first surfaces are opposite to the second surfaces.Type: ApplicationFiled: March 14, 2022Publication date: September 14, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
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Publication number: 20230065884Abstract: A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
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Publication number: 20230026141Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.Type: ApplicationFiled: July 23, 2021Publication date: January 26, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
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Publication number: 20230014913Abstract: In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.Type: ApplicationFiled: March 4, 2022Publication date: January 19, 2023Applicants: Taiwan Semiconductor Manufacturing Co., Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
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Patent number: 11065724Abstract: Laser weldable compositions are provided which in various examples include a tricyclodecane dimethanol-modified copolymer, a terephthalate-type polyester and an inorganic filler. Compared with compositions without the tricyclodecane dimethanol-modified copolymer, the compositions of the invention have improved, uniform laser transmittance, thereby welded products including the compositions have improved bonding strength and require stronger tensile strength to be torn apart.Type: GrantFiled: April 20, 2020Date of Patent: July 20, 2021Assignee: CHANG CHUN PLASTICS CO., LTD.Inventors: Te-Shun Lin, Cheng-Hsiang Hung, Hsin-Hsien Tsai, Po-Yuan Cheng, Yung-Sheng Lin, Kuen-Yuan Hwang, June-Yen Chou
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Publication number: 20160285343Abstract: A magnetic windblown device has a housing, a windblown assembly, a magnetic assembly, a power assembly, a decoration, and at least one magnetic element. The windblown assembly and the magnetic assembly are mounted inside the housing. The power assembly is mounted in the housing and is electrically connected to the windblown assembly and the magnetic assembly. The decoration and the magnetic element are mounted in the housing. The windblown assembly generates airflow to make the decoration swing. The magnetic assembly changes the magnetic field to rotate and move the magnetic element. Office staff feels relaxed and inspired by watching the swinging decoration and the rotating/moving magnetic element.Type: ApplicationFiled: March 26, 2015Publication date: September 29, 2016Inventors: Cheng-Hsin Tsai, Jia-Cing Gong, Po-Yuan Cheng, Hung-Chieh Chen, Ming-Hsiung Hung
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Publication number: 20140159490Abstract: A method for detecting output power of a power converter is applied for detecting power outputted from the power converter as an electronic device is electrically connected with the power converter. The method comprises the following steps: First, it is to control a battery of the electronic device to supplies power to the electronic device and disconnecting a power supply path of supplying the power from the power converter to the electronic device. After disconnecting the power supply path, the impedance of the voltage dividing circuit of the power converter is regulated to vary the power supply voltage outputted to the electronic device. And then, the varied power supply voltage is detected and the power outputted form the power converter will be recognized according to the power supply voltage.Type: ApplicationFiled: November 14, 2013Publication date: June 12, 2014Applicant: PEGATRON CORPORATIONInventors: PO-YUAN CHENG, CHUN-WEI KO
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Patent number: 8663599Abstract: The invention discloses a pharmaceutical composition of pH-sensitive liposome nanoparticles for lodging in a target tissue cell in situ of an animal subject, the nanoparticles comprising a proton-releasing photosensitive compound that releases protons upon photolysis, wherein the compound is in vesicles of the liposomes. A light or UV light is provided to induce the photosensitive compound to release the protons, thus the released protons causing the pH-sensitive liposome to decompose.Type: GrantFiled: November 21, 2012Date of Patent: March 4, 2014Assignees: GP Medical, Inc., National Tsing Hua UniversityInventors: Hsing-Wen Sung, Zi-Xian Liao, Min-Fan Chung, Ko-Jie Chen, Po-Yuan Cheng, Hosheng Tu
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Patent number: 7223157Abstract: A chemical-mechanical polishing apparatus comprising at least a polishing platen, a polishing pad, a slurry supplying piping, a polishing pad conditioner, a chemical reagent supplying piping and a splitting piping is provided. The polishing platen has a plurality of slurry outlets disposed thereon and the polishing pad is disposed on the polishing platen. The slurry supplying piping is connected to the bottom of the polishing platen for delivering slurry to the surface of the polishing pad through the slurry outlets. The polishing pad conditioner is disposed over the polishing pad. The chemical reagent supplying piping is connected to the polishing pad conditioner for supplying the chemical reagent to the polishing conditioner. The splitting piping is connected between the slurry supplying piping and the chemical reagent supplying piping for providing chemical reagent to the surface of the polishing pad through the slurry supplying piping and the slurry outlets.Type: GrantFiled: August 30, 2005Date of Patent: May 29, 2007Assignee: United Microelectronics Corp.Inventors: Sheng-Yu Chen, Te-Sung Hung, Chung-Jun Cheng, Chi-Piao Cheng, Po-Yuan Cheng
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Publication number: 20070060028Abstract: A CMP slurry delivery system includes a delivery pipe, a first slurry supply reservoir coupled to the delivery pipe for supplying an abrasive, a second slurry supply reservoir coupled to the delivery pipe for supplying a clean chemical, a third slurry supply reservoir coupled to the delivery pipe for supplying a corrosion inhibitor, and a fourth slurry supply reservoir for supplying an oxidizer.Type: ApplicationFiled: October 30, 2006Publication date: March 15, 2007Inventors: Sheng-Yu Chen, Te-Sung Hung, Chi-Piao Cheng, Chung-Jung Cheng, Kaung-Wu Nieh, Po-Yuan Cheng, Jiann-Fu Chen, Chun-Ting Hu, Tzu-Yu Tseng, Tzu-Yi Hsieh, Hung-Chi Pai, Yung-Chieh Kuo
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Publication number: 20070049183Abstract: A chemical-mechanical polishing apparatus comprising at least a polishing platen, a polishing pad, a slurry supplying piping, a polishing pad conditioner, a chemical reagent supplying piping and a splitting piping is provided. The polishing platen has a plurality of slurry outlets disposed thereon and the polishing pad is disposed on the polishing platen. The slurry supplying piping is connected to the bottom of the polishing platen for delivering slurry to the surface of the polishing pad through the slurry outlets. The polishing pad conditioner is disposed over the polishing pad. The chemical reagent supplying piping is connected to the polishing pad conditioner for supplying the chemical reagent to the polishing conditioner. The splitting piping is connected between the slurry supplying piping and the chemical reagent supplying piping for providing chemical reagent to the surface of the polishing pad through the slurry supplying piping and the slurry outlets.Type: ApplicationFiled: August 30, 2005Publication date: March 1, 2007Inventors: Sheng-Yu Chen, Te-Sung Hung, Chung-Jung Cheng, Chi-Piao Cheng, Po-Yuan Cheng
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Publication number: 20060191871Abstract: A CMP slurry delivery system includes a delivery pipe, a first slurry supply reservoir coupled to the delivery pipe for supplying an abrasive, a second slurry supply reservoir coupled to the delivery pipe for supplying a clean chemical, a third slurry supply reservoir coupled to the delivery pipe for supplying a corrosion inhibitor, and a fourth slurry supply reservoir for supplying an oxidizer.Type: ApplicationFiled: February 25, 2005Publication date: August 31, 2006Inventors: Sheng-Yu Chen, Te-Sung Hung, Chi-Piao Cheng, Chung-Jung Cheng, Kaung-Wu Nieh, Po-Yuan Cheng, Jiann-Fu Chen, Chun-Ting Hu, Tzu-Yu Tseng, Tzu-Yi Hsieh, Hung-Chi Pai, Yung-Chieh Kuo