Abstract: A semiconductor device, a circuit board structure and a manufacturing forming thereof are provided. A circuit board structure includes a core layer, a first build-up layer and a second build-up layer. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer.

Abstract: A manufacturing method of a semiconductor package includes the following steps. A first lower semiconductor device and a second lower semiconductor device are provided. A plurality of first conductive pillars are formed on the first lower semiconductor device along a first direction parallel to a side of the first lower semiconductor device. A plurality of second conductive pillars are formed on the second lower semiconductor device along a second direction parallel to a side of the second lower semiconductor device, wherein the first direction is substantially collinear with the second direction. An upper semiconductor device is disposed on the first lower semiconductor device and the second lower semiconductor device and revealing a portion where the plurality of first conductive pillars and the plurality of second conductive pillars are disposed.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.

Abstract: A semiconductor device, a circuit board structure and a manufacturing forming thereof are provided. A circuit board structure includes a core layer, a first build-up layer and a second build-up layer. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer.

Abstract: An environment managing and monitoring system and a method using same are provided. The environment managing and monitoring system is configured to assist monitors to obtain real-time information of the monitoring field and control device in the monitoring field. The environmental managing and monitoring system includes at least one sub-system and a host system. The host system is configured to output a region of interest condition and a monitoring condition to the sub-system, wherein the sub-system is configured to generate monitoring results according to the monitoring conditions, and selects an image range from the captured wide-angle dynamic real-time images according to the region of interest condition.

Abstract: A wind turbine system includes a wind turbine and switching devices. Each switching device is for stabilizing an electric output of a coil of the wind turbine, and includes a voltage converter circuit, a switch circuit electrically connected between the voltage converter circuit and an output interface, and a controller circuit. The controller circuit is configured to calculate an input electric power of input electricity into the voltage converter circuit, to calculate an output electric power of output electricity outputted by the voltage converter circuit, and to control the switch circuit to operate in one of a closed state and an open state according to the input electric power and the output electric power.

Abstract: A switching device for stabilizing an electric output of a solar panel is provided, and includes a voltage converter circuit, a switch circuit connected between the solar panel and the voltage converter circuit, and a control unit. The voltage converter circuit converts input voltage and current received from the solar panel through the switch circuit into output voltage and current. The control unit calculates an input electric power and an output electric power based on values of the input voltage and current and values of the output voltage and current, and controls the switch circuit to switch between a closed state and an open state according to the input electric power and the output electric power.

Abstract: A wind turbine system includes a wind turbine and switching devices. Each switching device is for stabilizing an electric output of a coil of the wind turbine, and includes a voltage converter circuit, a switch circuit electrically connected between the voltage converter circuit and an output interface, and a controller circuit. The controller circuit is configured to calculate an input electric power of input electricity into the voltage converter circuit, to calculate an output electric power of output electricity outputted by the voltage converter circuit, and to control the switch circuit to operate in one of a closed state and an open state according to the input electric power and the output electric power.

Abstract: A switching device for stabilizing an electric output of a solar panel is provided, and includes a voltage converter circuit, a switch circuit connected between the solar panel and the voltage converter circuit, and a control unit. The voltage converter circuit converts input voltage and current received from the solar panel through the switch circuit into output voltage and current. The control unit calculates an input electric power and an output electric power based on values of the input voltage and current and values of the output voltage and current, and controls the switch circuit to switch between a closed state and an open state according to the input electric power and the output electric power.

Abstract: A preservation article is provided which includes nanosilver-containing anti-bacterial granules blended with plastic materials. The granules blended with the plastic materials are present in the plastic materials in an amount of 0.1 to 0.8 weight percentage based on the weight of the plastic materials.