Patents by Inventor Po-Yuan Kuo
Po-Yuan Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240420991Abstract: A semiconductor device with a deep trench isolation and a shallow trench isolation includes a substrate. The substrate is divided into a high voltage transistor region and a low voltage transistor region. A deep trench is disposed within the high voltage transistor region. The deep trench includes a first trench and a second trench. The first trench includes a first bottom. The second trench extends from the first bottom toward a bottom of the substrate. A first shallow trench and a second shallow trench are disposed within the low voltage transistor region. A length of the first shallow trench is the same as a length of the second trench. An insulating layer fills in the first trench, the second trench, the first shallow trench and the second shallow trench.Type: ApplicationFiled: July 7, 2023Publication date: December 19, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Jing-Wen Huang, Chih-Yuan Wen, Lung-En Kuo, Po-Chang Lin, Kun-Yuan Liao, Chung-Yi Chiu
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Patent number: 12166015Abstract: A semiconductor package includes a lower semiconductor device, a plurality of conductive pillars, an upper semiconductor device, an encapsulating material, and a redistribution structure. The plurality of conductive pillars are disposed on the lower semiconductor device along a direction parallel to a side of the lower semiconductor device. The upper semiconductor device is disposed on the lower semiconductor device and reveals a portion of the lower semiconductor device where the plurality of conductive pillars are disposed, wherein the plurality of conductive pillars disposed by the same side of the upper semiconductor device and the upper semiconductor device comprises a cantilever part cantilevered over the at least one lower semiconductor device. The encapsulating material encapsulates the lower semiconductor device, the plurality of conductive pillars, and the upper semiconductor device. The redistribution structure is disposed over the upper semiconductor device and the encapsulating material.Type: GrantFiled: March 16, 2023Date of Patent: December 10, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo-Lung Pan, Ting Hao Kuo, Yu-Chia Lai, Mao-Yen Chang, Po-Yuan Teng, Shu-Rong Chun
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Patent number: 12166128Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: GrantFiled: July 27, 2023Date of Patent: December 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Publication number: 20240395939Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.Type: ApplicationFiled: July 31, 2024Publication date: November 28, 2024Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
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Publication number: 20240332192Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.Type: ApplicationFiled: March 30, 2023Publication date: October 3, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
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Publication number: 20240329300Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.Type: ApplicationFiled: March 28, 2023Publication date: October 3, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
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Publication number: 20240249494Abstract: An environment managing and monitoring system and a method using same are provided. The environment managing and monitoring system is configured to assist monitors to obtain real-time information of the monitoring field and control device in the monitoring field. The environmental managing and monitoring system includes at least one sub-system and a host system. The host system is configured to output a region of interest condition and a monitoring condition to the sub-system, wherein the sub-system is configured to generate monitoring results according to the monitoring conditions, and selects an image range from the captured wide-angle dynamic real-time images according to the region of interest condition.Type: ApplicationFiled: September 4, 2023Publication date: July 25, 2024Inventors: Yung-tai SU, Hsin-lung HSIEH, Yu-hsuan LIAO, Yu-min CHUANG, Pang-tzu LIU, Chun-yueh CHEN, Jia-hao LU, Cheng-ju HSUIEH, Ching-wei LEE, Tsung-hsun TSAI, Po-yuan KUO, Po-yi WU, Chen-wei CHOU
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Patent number: 10666175Abstract: A wind turbine system includes a wind turbine and switching devices. Each switching device is for stabilizing an electric output of a coil of the wind turbine, and includes a voltage converter circuit, a switch circuit electrically connected between the voltage converter circuit and an output interface, and a controller circuit. The controller circuit is configured to calculate an input electric power of input electricity into the voltage converter circuit, to calculate an output electric power of output electricity outputted by the voltage converter circuit, and to control the switch circuit to operate in one of a closed state and an open state according to the input electric power and the output electric power.Type: GrantFiled: August 15, 2017Date of Patent: May 26, 2020Assignees: TOYO SEKI (TAIWAN) CO., LTD.Inventors: Po-Yuan Kuo, Chun-Lin Kuo, Po-Chia Kuo
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Patent number: 10396649Abstract: A switching device for stabilizing an electric output of a solar panel is provided, and includes a voltage converter circuit, a switch circuit connected between the solar panel and the voltage converter circuit, and a control unit. The voltage converter circuit converts input voltage and current received from the solar panel through the switch circuit into output voltage and current. The control unit calculates an input electric power and an output electric power based on values of the input voltage and current and values of the output voltage and current, and controls the switch circuit to switch between a closed state and an open state according to the input electric power and the output electric power.Type: GrantFiled: August 15, 2017Date of Patent: August 27, 2019Assignees: ASIAN H.Y. NANO TECHNOLOGY CO., LTD.Inventors: Po-Yuan Kuo, Chun-Lin Kuo, Po-Chia Kuo
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Publication number: 20180342969Abstract: A wind turbine system includes a wind turbine and switching devices. Each switching device is for stabilizing an electric output of a coil of the wind turbine, and includes a voltage converter circuit, a switch circuit electrically connected between the voltage converter circuit and an output interface, and a controller circuit. The controller circuit is configured to calculate an input electric power of input electricity into the voltage converter circuit, to calculate an output electric power of output electricity outputted by the voltage converter circuit, and to control the switch circuit to operate in one of a closed state and an open state according to the input electric power and the output electric power.Type: ApplicationFiled: August 15, 2017Publication date: November 29, 2018Inventors: Po-Yuan Kuo, Chun-Lin Kuo, Po-Chia Kuo
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Publication number: 20180316254Abstract: A switching device for stabilizing an electric output of a solar panel is provided, and includes a voltage converter circuit, a switch circuit connected between the solar panel and the voltage converter circuit, and a control unit. The voltage converter circuit converts input voltage and current received from the solar panel through the switch circuit into output voltage and current. The control unit calculates an input electric power and an output electric power based on values of the input voltage and current and values of the output voltage and current, and controls the switch circuit to switch between a closed state and an open state according to the input electric power and the output electric power.Type: ApplicationFiled: August 15, 2017Publication date: November 1, 2018Inventors: Po-Yuan Kuo, Chun-Lin Kuo, Po-Chia Kuo
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Publication number: 20080213328Abstract: A preservation article is provided which includes nanosilver-containing anti-bacterial granules blended with plastic materials. The granules blended with the plastic materials are present in the plastic materials in an amount of 0.1 to 0.8 weight percentage based on the weight of the plastic materials.Type: ApplicationFiled: February 29, 2008Publication date: September 4, 2008Inventors: Yao-Nien Chung, Pi-Ming Chu, Po-Yuan Kuo