Abstract: A display device includes a panel, a conductive layer, a first color filter array and a second color filter array. The panel has a display surface and multiple sub-pixel regions where the multiple sub-pixel regions and the conductive layer are on this display surface. The first color filter array including multiple first color filter elements is disposed on the conductive layer while the second color filter array including multiple second color filter elements is disposed on the first color filter array. One first overlaid region and one second overlaid region are defined by the orthogonal projections of the color filter elements within one of the sub-pixel regions. In one sub-pixel region, a section of the first overlaid region does not overlap a section of the second overlaid region.

Abstract: An electronic device includes a first insulating layer, a first conductive portion, a second conductive portion, a transistor, and an electronic unit. The first insulating layer has a first opening penetrating the first insulating layer along a first direction. The first conductive portion is disposed in the first opening. The second conductive portion is electrically connected to the first conductive portion. The transistor is electrically connected to the second conductive portion. The electronic unit is electrically connected to the first conductive portion. In a cross-sectional view of the electronic device, the electronic unit and the second conductive portion are disposed on two opposite sides of the first insulating layer respectively, the first conductive portion has a first length along a second direction perpendicular to the first direction, the second conductive portion has a second length along the second direction, and the first length is different from the second length.

Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: A semiconductor device is disclosed herein. The semiconductor device includes a routing structure. The routing structure has an intermediate conductive routing layer. The intermediate conductive routing layer includes a first mesh conductive layer formed in a predetermined second region of the semiconductor device and a second mesh conductive layer formed in a predetermined first region of the semiconductor device. The first mesh conductive layer and the second mesh conductive layer are electrically isolated from each other. The intermediate conductive routing layer further includes multiple first conductive islands formed in the predetermined first region and multiple second conductive islands formed in the predetermined second region.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: A touch display device is provided in this disclosure. The touch display device includes a substrate, a first conductive layer, a second conductive layer, a stacked structure, an inorganic light emitting unit, and a touch sensing circuit. The first conductive layer is disposed on the substrate. The first conductive layer includes a gate electrode. The second conductive layer is disposed on the first conductive layer. The second conductive layer includes a source electrode and a drain electrode. The stacked structure is disposed on the substrate. The stacked structure includes a conductive channel and a sensing electrode. The inorganic light emitting unit is disposed on the stacked structure. The inorganic light emitting unit is electrically connected with the drain electrode via the conductive channel. The touch sensing circuit is electrically connected with the sensing electrode.

Abstract: A detection system for determining alpha-methylacyl-CoA (AMACR) levels in a bodily sample includes at least one reaction solution for generating H2O2 upon combination with AMACR in the bodily sample and a biosensor for determining a level of generated H2O2. The reaction solution includes a (2R)-2-methylacyl-CoA epimer that can be chirally inverted by AMACR to a (2S)-2-methylacyl-CoA epimer and an enzyme that carries out beta oxidation with the (2S)-2-methylacyl-CoA epimer to generate hydrogen peroxide (H2O2).

Abstract: A primary connector (10, 20) includes a primary housing (11, 31) and a number of terminal groups. The primary housing includes a periphery wall (111, 311) and a side wall (112, 312) disposed at opposite sides of the primary housing and extending along a longitudinal direction, a slot (113, 313) defined between the periphery wall and the side wall, and a number of passageways (114, 314) extending along a transverse direction for receiving the number of terminal groups. Each terminal group includes a predetermined terminal (22, 42) having a contact section (221, 421) exposed to the slot and a pair of soldering portions (222, 422) respectively extending from opposite sides of the contact section and inserted outwardly from the periphery wall and the side wall.

Abstract: A primary connector (10, 20) includes a primary housing (11, 31) and a number of terminal groups. The primary housing includes a periphery wall (111, 311) and a side wall (112, 312) disposed at opposite sides of the primary housing and extending along a longitudinal direction, a slot (113, 313) defined between the periphery wall and the side wall, and a number of passageways (114, 314) extending along a transverse direction for receiving the number of terminal groups. Each terminal group includes a predetermined terminal (22, 42) having a contact section (221, 421) exposed to the slot and a pair of soldering portions (222, 422) respectively extending from opposite sides of the contact section and inserted outwardly from the periphery wall and the side wall.

Abstract: A detection system for determining alpha-methylacyl-CoA (AMACR) levels in a bodily sample includes at least one reaction solution for generating H2O2 upon combination with AMACR in the bodily sample and a biosensor for determining a level of generated H2O2. The reaction solution includes a (2R)-2-methylacyl-CoA epimer that can be chirally inverted by AMACR to a (2S)-2-methylacyl-CoA epimer and an enzyme that carries out beta oxidation with the (2S)-2-methylacyl-CoA epimer to generate hydrogen peroxide (H2O2).

Abstract: An electronic device comprises a control module, a transceiving module, a first isolator, and a second isolator. The control module is configured to generate a control signal in response to a signal from an MCU. The transceiving module comprises a transceiving unit, which further comprises a first switch and a second switch. The electronic device further comprises a first isolator and a second isolator. The first isolator is external to the transceiving unit and is coupled between the first switch and a bus. Moreover, the first isolator is configured to isolate a first spike current coming from the bus. The second isolator is external to the transceiving unit and is coupled between a terminal of the second switch and the bus. Moreover, the second isolator is configured to direct a second spike current coming from the bus to the ground.

Abstract: A printed circuit board module includes a first printed circuit board defining a plurality of front conductive pads formed on a top surface thereof and arranged along a transversal direction, and a second printed circuit board located on and welded to the first printed circuit board, the second printed board defining a plurality of first contacts formed on a top surface thereof for mating with a complementary connector.

Abstract: A terminal comprises an upper arm having a top surface for a mating area; a lower arm paralleled with the upper arm and having a bottom surface soldering area; and a connecting arm connected with the upper arm and the lower arm.