Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: An electrical connector includes a stiffener, a rail frame pivotally mounted to one end of the stiffener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the stiffener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels and above the sliding channels in the vertical direction.

Abstract: An electrical connector includes a fastener plate, a rail frame pivotally mounted to one end of the fastener plate, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the fastener plate outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels. A pair of protection blocks are located in front of the pair of sliding channels for protecting the latches of the carrier frame or the CPU.

Abstract: An electrical connector includes a stiffener, a rail frame pivotally mounted to one end of the stiffener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the stiffener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels and above the sliding channels in the vertical direction.

Abstract: An electrical connector includes a fastener, a rail frame pivotally mounted to one end of the fastener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the fastener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels. A pair of protection blocks are located in front of the pair of sliding channels for protecting the latches of the carrier frame or the CPU.

Abstract: The electrical connector assembly includes an insulative housing and a plurality of contacts retained in the housing. The stand includes a support and a spring supporting the support. The electrical connector is seated upon the support and moveable along with the support in the vertical direction due to deformation of the spring. Each of the contacts includes an upper contacting section and a lower contacting section. An electronic component located upon the housing and downwardly pressing and mechanically and electrically connected to the upper contacting sections. An FPC is sandwiched between the support and the electrical connector and mechanically and electrically connected to the lower contacting sections.

Abstract: The electrical connector includes a frame to assemble a plurality of socket thereto. Each socket includes a plurality of contacts, two inner sides in confrontation with the neighboring sockets, and two outer sides in confrontation with the frame. The frame includes an exterior peripheral structure and an interior cross structure. The outer sides are attached to the exterior peripheral structure while the inner sides are attached to the interior cross structure.

Abstract: The electrical connector assembly includes an insulative housing and a plurality of contacts retained in the housing. The stand includes a support and a spring supporting the support. The electrical connector is seated upon the support and moveable along with the support in the vertical direction due to deformation of the spring. Each of the contacts includes an upper contacting section and a lower contacting section. An electronic component located upon the housing and downwardly pressing and mechanically and electrically connected to the upper contacting sections. An FPC is sandwiched between the support and the electrical connector and mechanically and electrically connected to the lower contacting sections.

Abstract: The electrical connector includes a frame to assemble a plurality of socket thereto. Each socket includes a plurality of contacts, two inner sides in confrontation with the neighboring sockets, and two outer sides in confrontation with the frame. The frame includes an exterior peripheral structure and an interior cross structure. The outer sides are attached to the exterior peripheral structure while the inner sides are attached to the interior cross structure.

Abstract: An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a semiconductor substrate, at least one deep n-well in the semiconductor substrate, at least one p-channel metal-oxide-semiconductor transistor in the deep n-well, at least one n-channel metal-oxide-semiconductor transistor outside of the deep n-well, an first interconnect structure, and a protection component. Both of the p-channel metal-oxide-semiconductor transistor and the n-channel metal-oxide-semiconductor transistor are disposed in the semiconductor substrate, and are electrically coupled by the first interconnect structure. The protection component is disposed in the semiconductor substrate, wherein the protection component is electrically coupled to the deep n-well.

Abstract: An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a semiconductor substrate, at least one deep n-well in the semiconductor substrate, at least one p-channel metal-oxide-semiconductor transistor in the deep n-well, at least one n-channel metal-oxide-semiconductor transistor outside of the deep n-well, an first interconnect structure, and a protection component. Both of the p-channel metal-oxide-semiconductor transistor and the n-channel metal-oxide-semiconductor transistor are disposed in the semiconductor substrate, and are electrically coupled by the first interconnect structure. The protection component is disposed in the semiconductor substrate, wherein the protection component is electrically coupled to the deep n-well.