Patents by Inventor PO-YUN SHIH

PO-YUN SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11853137
    Abstract: Methods and systems for thermal management of components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the thermal environment and/or thermal states of components of the power supply.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: December 26, 2023
    Assignee: Dell Products L.P.
    Inventors: Yu-Hung Lai, Po-Yun Shih
  • Publication number: 20230333619
    Abstract: Methods and systems for powering components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the type of power being supplied to the power supplies. The power supplies may modify their operation based on the type of input power being supplied to them so that conditioned power may be provided even when changes to the power supplied to the power supplies occur.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Inventors: YU-HUNG LAI, PO-YUN SHIH, YI-CHE HSU
  • Publication number: 20230221783
    Abstract: Methods and systems for thermal management of components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the thermal environment and/or thermal states of components of the power supply.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 13, 2023
    Inventors: YU-HUNG LAI, PO-YUN SHIH