Patents by Inventor Poh Chieh Benny Poon

Poh Chieh Benny Poon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die warpage control for thin die assembly
    Patent number: 9659899
    Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: May 23, 2017
    Assignee: Intel Corporation
    Inventors: Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel R. Arana, Eric J. Li, Nitin A. Deshpande, Jiraporn Seangatith, Poh Chieh Benny Poon
  • DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY
    Publication number: 20150318258
    Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.
    Type: Application
    Filed: July 10, 2015
    Publication date: November 5, 2015
    Applicant: INTEL CORPORATION
    Inventors: SANDEEP B. SANE, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel R. Arana, Eric J. Li, Nitin A. Deshpande, Jiraporn Seangatith, Poh Chieh Benny Poon
  • Die warpage control for thin die assembly
    Patent number: 9123732
    Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: September 1, 2015
    Assignee: Intel Corporation
    Inventors: Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel R. Arana, Eric J. Li, Nitin A. Deshpande, Jiraporn Seangatith, Poh Chieh Benny Poon
  • DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY
    Publication number: 20140091470
    Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Inventors: Sandeep B. Sane, Shandar Ganapathysubramanian, Jorge Sanchez, Leonel R. Arana, Eric J. Li, Nitin A. Deshpande, Jiraporn Seangatith, Poh Chieh Benny Poon