Patents by Inventor Poh Liang Yap

Poh Liang Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240083743
    Abstract: A microelectromechanical systems (MEMS) package includes a first MEMS package and a second MEMS package laterally spaced apart from the first MEMS package. The first MEMS package includes a first device substrate including a first MEMS device, a first cap substrate bonded to the first device substrate, where the first cap substrate encloses a first cavity and a vent hole connected to the first cavity. A first sealing layer is filled in the vent hole, where the first sealing layer is disposed between the first device substrate and the first cap substrate. The second MEMS package includes a second device substrate including a second MEMS device and a second cap substrate. The second cap substrate is bonded to the second device substrate and encloses a second cavity. The first cavity has a first pressure, and the second cavity have a second pressure different from the first pressure.
    Type: Application
    Filed: September 12, 2022
    Publication date: March 14, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: RAKESH CHAND, RAMACHANDRAMURTHY PRADEEP YELEHANKA, Sock Kuan Soo, Poh Liang Yap, GUOFU ZHOU