Abstract: A multi-package unit having stacked packages is provided. A multi-package unit may include a first package and a second package mounted on the first package. The first package may be a leadframe package that includes metal leads extending beyond the perimeter of the first package. The first package may include a first integrated circuit die assembled within the first package using the wirebond configuration or the flip-chip configuration. The second package may be a leadframe package or a leadless package that includes a second integrated circuit die. The second package may be smaller than the first package. The first and second integrated circuit dies may be formed using different integrated circuit fabrication technologies.

Abstract: The disclosure describes a method for controlling a voltage that is applied to a voltage controlled circuit element. In one example, the method includes controlling, by a semiconductor light source, a resistance value of a photoresistor coupled to a voltage controlled circuit element. The method includes applying, by a gate driver and via the photoresistor, a voltage to the voltage controlled circuit element. The method further includes controlling the voltage applied to the voltage controlled circuit element in order to control a current through the voltage controlled circuit element. In some examples, controlling the voltage applied to the voltage controlled circuit element may be accomplished by controlling the resistance value of the photoresistor in order to control a voltage drop across the photoresistor. Circuits that implement the method are also described.

Abstract: The disclosure describes a method for controlling a voltage that is applied to a voltage controlled circuit element. In one example, the method includes controlling, by a semiconductor light source, a resistance value of a photoresistor coupled to a voltage controlled circuit element. The method includes applying, by a gate driver and via the photoresistor, a voltage to the voltage controlled circuit element. The method further includes controlling the voltage applied to the voltage controlled circuit element in order to control a current through the voltage controlled circuit element. In some examples, controlling the voltage applied to the voltage controlled circuit element may be accomplished by controlling the resistance value of the photoresistor in order to control a voltage drop across the photoresistor. Circuits that implement the method are also described.

Abstract: A mounting system for a storage medium comprises a washer. The washer has a peripheral rim that is subject to a mounting distortion. The storage medium comprises a mounting rim facing the peripheral rim. The mounting rim is separated from the peripheral rim by an isolation space. Isolation material is disposed in the isolation space. The isolation material supports the storage medium on the washer. The isolation material deforms to relieve transmission of the mounting distortion to the mounting rim.