Patents by Inventor Poh Yoong Kong

Poh Yoong Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9236166
    Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: January 12, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Eugen Milke, Jürgen Dick, Peter Prenosil, Frank-Werner Wulff, Poh Yoong Kong
  • Publication number: 20130213689
    Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.
    Type: Application
    Filed: July 18, 2011
    Publication date: August 22, 2013
    Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    Inventor: Poh Yoong Kong