Patents by Inventor Polly Liu

Polly Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12287159
    Abstract: A heat dissipation module includes a plurality of heat dissipation units arranged along a longitudinal direction of the heat dissipation module. Each heat dissipation unit has a plurality of heat dissipation fins arranged at intervals along a transverse direction of the heat dissipation module. The heat dissipation fins of a first heat dissipation unit of a pair of adjacent heat dissipation units are each coupled with one of the heat dissipation fins of a second heat dissipation unit of the pair of adjacent heat dissipation units by a coupling structure. The heat dissipation fins of the first heat dissipation unit and the heat dissipation fins of the second heat dissipation unit are displaceable with respect to each other within a certain range.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: April 29, 2025
    Assignee: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: WenYu (Vindy) Liu, Xingjie (Steven) Ge, Xinbo (Polly) Liu
  • Publication number: 20230030112
    Abstract: A heat dissipation module includes a plurality of heat dissipation units arranged along a longitudinal direction of the heat dissipation module. Each heat dissipation unit has a plurality of heat dissipation fins arranged at intervals along a transverse direction of the heat dissipation module. The heat dissipation fins of a first heat dissipation unit of a pair of adjacent heat dissipation units are each coupled with one of the heat dissipation fins of a second heat dissipation unit of the pair of adjacent heat dissipation units by a coupling structure. The heat dissipation fins of the first heat dissipation unit and the heat dissipation fins of the second heat dissipation unit are displaceable with respect to each other within a certain range.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 2, 2023
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: WenYu (Vindy) Liu, Xingjie (Steven) Ge, Xinbo (Polly) Liu
  • Patent number: 11108200
    Abstract: A socket connector includes a housing defining a pair of rows of insertion cavities and an elastic fastener formed on a bottom wall of each insertion cavity. Each row of insertion cavities has at least one insertion cavity. The elastic fastener is adapted to engage a plug connector inserted into the insertion cavity.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 31, 2021
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Chenxi (Josh) Wang, Hongqiang (Sean) Han, Xinbo (Polly) Liu, Clarence Leon Yu, Ping (Jane) Wei
  • Publication number: 20200076141
    Abstract: A socket connector includes a housing defining a pair of rows of insertion cavities and an elastic fastener formed on a bottom wall of each insertion cavity. Each row of insertion cavities has at least one insertion cavity. The elastic fastener is adapted to engage a plug connector inserted into the insertion cavity.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Chenxi (Josh) Wang, Hongqiang (Sean) Han, Xinbo (Polly) Liu, Clarence Leon Yu, Ping (Jane) Wei
  • Patent number: 9820382
    Abstract: A connector is provided and includes a bottom, a top case positioned above the bottom case, and a partition is positioned between the top case and the bottom case. A plurality of ports is provided between the top case and the bottom case and the ports are separated by the partition. A temperature exchange device is mounted on the bottom case.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: November 14, 2017
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Honghao Wu, Marshall Chen, Tim Xue, Polly Liu, Helena Sun
  • Patent number: 9696506
    Abstract: A connector housing assembly is disclosed having a housing, a plurality of compressible heat conducting members and a monolithic heat sink. The housing has a first direction corresponding to a height direction of the housing, a second direction parallel to a heat generating module insertion direction, and a third direction perpendicular to the first direction and the second direction. The housing includes a plurality of module receiving ports positioned side by side in the third direction, a plurality of conductor receiving spaces corresponding to the plurality of module receiving ports respectively, and a heat sink installation surface. The plurality of compressible heat conducting members are positioned in the plurality of conductor receiving spaces respectively, each having an elasticity in the first direction. The monolithic heat sink is positioned on a heat sink installation surface of the housing, covering and in surface-contact with the plurality of compressible heat conducting members.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: July 4, 2017
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Honghao Wu, Marshall Chen, Tim Xue, Polly Liu, Helena Sun
  • Publication number: 20150296638
    Abstract: A connector housing assembly is disclosed having a housing, a plurality of compressible heat conducting members and a monolithic heat sink. The housing has a first direction corresponding to a height direction of the housing, a second direction parallel to a heat generating module insertion direction, and a third direction perpendicular to the first direction and the second direction. The housing includes a plurality of module receiving ports positioned side by side in the third direction, a plurality of conductor receiving spaces corresponding to the plurality of module receiving ports respectively, and a heat sink installation surface. The plurality of compressible heat conducting members are positioned in the plurality of conductor receiving spaces respectively, each having an elasticity in the first direction. The monolithic heat sink is positioned on a heat sink installation surface of the housing, covering and in surface-contact with the plurality of compressible heat conducting members.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 15, 2015
    Applicant: TYCO ELECTRONICS (SHANGHAI) CO. LTD.
    Inventors: Honghao Wu, Marshall Chen, Tim Xue, Polly Liu, Helena Sun
  • Publication number: 20150289407
    Abstract: A connector is provided and includes a bottom, a top case positioned above the bottom case, and a partition is positioned between the top case and the bottom case. A plurality of ports is provided between the top case and the bottom case and the ports are separated by the partition. A temperature exchange device is mounted on the bottom case.
    Type: Application
    Filed: April 1, 2015
    Publication date: October 8, 2015
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Honghao Wu, Marshall Chen, Tim Xue, Polly Liu, Helena Sun