Abstract: In one embodiment, the present invention comprises a method for fixedly and electronically coupling an electronic component to a polymer substrate. In this embodiment, a polymer substrate is received. The polymer substrate has an electronic component disposed proximate a bonding agent which is coupled to the polymer substrate. The present embodiment also provides a heat shielding fixture which is configured to shield at least a portion of the polymer substrate from a heat source. The heat shielding fixture is configured to allow heat from the heat source to access the bonding agent. The present embodiment then subjects the bonding agent to the heat source such that the heat from the heat source causes the electronic component to be fixedly and electronically coupled to the polymer substrate once the bonding agent solidifies.