Patents by Inventor Ponnuswamy Palanisamy

Ponnuswamy Palanisamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6713862
    Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: March 30, 2004
    Assignee: Lamina Ceramics
    Inventors: Ponnuswamy Palanisamy, Attiganal Narayanaswamysreeram, Ellen Schwartz Tormey, Barry Jay Thaler, John Connolly, Ramon Ubaldo Martinelli, Ashok Narayan Prabhu, Mark Stuart Hammond, Joseph Mazzochette
  • Patent number: 6455930
    Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: September 24, 2002
    Assignee: Lamina Ceramics, Inc.
    Inventors: Ponnuswamy Palanisamy, Attiganal Narayanaswamy Sreeram, Ellen Schwartz Tormey, Barry Jay Thaler, John Connolly, Ramon Ubaldo Martinelli, Ashok Narayan Prabhu, Mark Stuart Hammond