Patents by Inventor Poong Kim
Poong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240261473Abstract: The present invention relates to a composite, a manufacturing method therefor, and a cosmetic filler composition using same, the composite comprising biodegradable particles with a network structure therein, and a water-soluble polymer. The composite has a cake formulation, and thus has excellent long-term storability and dispersibility.Type: ApplicationFiled: June 14, 2023Publication date: August 8, 2024Applicant: VAIM CO., LTD.Inventor: Gun Poong KIM
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Publication number: 20230149288Abstract: The present disclosure relates to a biodegradable polymer dispersion containing a lactic acid-based polymer, a lactic acid-based polymer and polyethylene glycol-containing block copolymer (PEG-PLA), and a hyaluronic acid mixture, wherein the biodegradable polymer dispersion has excellent physiological activity by itself, has excellent dispersion stability of the lactic acid-based polymer, and is capable of effectively supporting active ingredients. In addition, the present disclosure relates to a composition containing the biodegradable polymer dispersion and a skin improvement system.Type: ApplicationFiled: August 27, 2021Publication date: May 18, 2023Inventors: Gun Poong KIM, Suk Bae SEO, Kun Pil LEE
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Patent number: 10199772Abstract: A power distribution apparatus with a rotary-opening/closing type plug fixing device for a communication equipment rack is provided. The power distribution apparatus prevents poor connection resulting from accidentally touching other power plugs by fixing the power plug with the plug fixing device which rotates in one direction, and allows the separation of the plug fixing device with only one hand when separating the power plug, thereby enabling users to conveniently separate the power plug even in a narrow space.Type: GrantFiled: November 25, 2015Date of Patent: February 5, 2019Inventor: Ki Poong Kim
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Publication number: 20180351299Abstract: A power distribution apparatus with a rotary-opening/closing type plug fixing means for a communication equipment rack according to the present invention, when connecting a power plug connected to a communication equipment rack accommodating multiple communication equipment and electronic equipment, can prevent poor connection resulting from accidentally touching other power plugs by fixing the power plug with a plug fixing means which rotates in one direction, and allows the separation of the plug fixing means with only one hand when separating the power plug, thereby enabling users to conveniently separate the power plug even in a narrow space.Type: ApplicationFiled: November 25, 2015Publication date: December 6, 2018Inventor: Ki Poong KIM
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Patent number: 9850341Abstract: The present invention relates to a method for preparing polymer microparticles by a spray process, wherein a polymer solution obtained by dissolving a polyester-based polymer in ethylene carbonate (hereinafter, referred to as “EC”), which is a solvent, is sprayed at a low temperature hydrocarbon or alcohol solution, thereby preparing frozen EC/polymer microparticles, the frozen EC/polymer microparticles are dissolved in a salt aqueous solution, thereby dissolving and removing EC, and the residual EC in water is removed by washing.Type: GrantFiled: February 17, 2014Date of Patent: December 26, 2017Assignee: VAIM CO., LTD.Inventor: Gun Poong Kim
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Publication number: 20160002393Abstract: The present invention relates to a method for preparing polymer microparticles by a spray process, wherein a polymer solution obtained by dissolving a polyester-based polymer in ethylene carbonate (hereinafter, referred to as “EC”), which is a solvent, is sprayed at a low temperature hydrocarbon or alcohol solution, thereby preparing frozen EC/polymer microparticles, the frozen EC/polymer microparticles are dissolved in a salt aqueous solution, thereby dissolving and removing EC, and the residual EC in water is removed by washing.Type: ApplicationFiled: February 17, 2014Publication date: January 7, 2016Inventor: Gun Poong KIM
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Patent number: 8580053Abstract: A method for producing a Ta sputtering target including the following steps: (a) a step of forging a Ta ingot, comprising subjecting the Ta ingot to a forging pattern over at least 3 times, wherein each forging pattern is “a cold forging step comprising stamp-forging and upset-forging operations alternatively repeated over at least 3 times; (b) an in-process vacuum heat-treating step carried out between every successive two forging patterns to thus prepare a Ta billet; (c) a step of rolling the Ta billet to obtain a rolled plate; and (d) a step of vacuum heat-treating the rolled plate to obtain a Ta sputtering target. A sputtering target produced by the above method.Type: GrantFiled: July 13, 2011Date of Patent: November 12, 2013Assignee: Ulvac, Inc.Inventors: Motonori Sato, Poong Kim, Manabu Ito, Tadashi Masuda
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Patent number: 8329856Abstract: The present invention relates to a preparation method for a biodegradable polymer microparticle and a microparticle prepared by the method. More particularly, the present invention relates to a method for preparing a polymer microparticle, wherein the method includes the steps of: dissolving a biodegradable polyester-based polymer in DMSO (Dimethyl Sulfoxide); spraying the solution in a low temperature hydrocarbon solution to provide a frozen DMSO microparticle; adding the microparticle in a low temperature salt aqueous solution to dissolve DMSO; and removing salt. The present invention provides a method for preparing a novel polymer microsphere which can be injected through a syringe due to excellent physical properties (such as biocompatibility, biodegradability, porosity, mechanical strength) and the microcarrier's size-adjustability, and can be easily mass-produced.Type: GrantFiled: June 13, 2011Date of Patent: December 11, 2012Assignee: Regen Biotech Inc.Inventors: Gun Poong Kim, Yong Hoon Lee, Kun Pil Lee
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Publication number: 20120305391Abstract: Disclosed are a manufacturing method for a LiCoO2 sintered body, said manufacturing method enabling the safe manufacturing of a high density sintered body, and a sputtering target. The LiCoO2 sintered body manufacturing method includes a step in which LiCoO2 powder is filled into a mold. The pressure inside the mold is reduced, and the LiCoO2 powder is pressure sintered inside the mold at a temperature between 800° C. and 880° C. inclusive. The above method enables the safe production of a LiCoO2 sintered body having a relative density of at least 95% and an average particle diameter of 10 ?m-30 ?m inclusive.Type: ApplicationFiled: December 24, 2010Publication date: December 6, 2012Applicant: ULVAC, INC.Inventors: Poong Kim, Koukou Suu, Shouichi Hashiguchi, Takanori Mikashima, Takatoshi Oginosawa, Wataru Iteue
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Publication number: 20120305392Abstract: Provided is a method for stably manufacturing high-density sintered LiCoO2. Said method uses a CIP-and-sintering method, which has a forming step using cold hydrostatic pressing and a sintering step. The pressing force is at least 1000 kg/cm2, the sintering temperature is between 1050° C. and 1120° C., and the sintering time is at least two hours. This makes it possible to stably manufacture sintered LiCoO2 with a relative density of at least 90%, a resistivity of at most 3 k?·cm, and a mean grain diameter between 20 and 50 ?m.Type: ApplicationFiled: December 24, 2010Publication date: December 6, 2012Applicant: ULVAC, INC.Inventors: Poong Kim, Koukou Suu, Shouichi Hashiguchi, Takanori Mikashima, Ryouta Uezono
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Publication number: 20120055787Abstract: [Object] To provide a sputtering target allowing component metals to be separated from each other by a simple process and a method of processing the sputtering target. [Solving Means] A method of processing a sputtering target according to the present invention performs a hydrogen embrittlement process with respect to a sputtering target 1 including a first target portion 3 made of a first material being a non hydrogen embrittlement material and a second target 4 portion made of a second material being a hydrogen embrittlement material, which are bonded to each other, to thereby separate from the sputtering target 1 the second target portion 4, collects the second material, and collects the first material. By utilizing difference in hydrogen embrittlement between the first material and the second material, the first material and the second material are separated from each other and collected. It is possible to efficiently collect the first material and the second material.Type: ApplicationFiled: May 18, 2010Publication date: March 8, 2012Applicant: ULVAC, INC.Inventors: Akira Ohba, Junichi Nitta, Nobuhiro Harada, Poong Kim, Yasuo Mihara
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Publication number: 20120018664Abstract: To obtain a method of producing a high-density lead zirconium titanate-based sintered body having uniform crystalline phases and containing a large amount of PbO, provided is a method of producing a lead zirconium titanate-based sintered body, including: producing a pre-sintered body by sintering raw material powder of lead zirconium titanate having a stoichiometric composition at a temperature of 900° C. or more and 1,200° C. or less; pulverizing the pre-sintered body; producing lead-excessive mixed powder by adding PbO powder to powder obtained by pulverizing the pre-sintered body; and sintering the lead-excessive mixed powder at a temperature lower than the sintering temperature of the pre-sintered body. Because the sintering process is divided into two stages, a high-density (e.g., 95% or more) PZT sintered body constituted only of PZT having a stoichiometric composition in which PbZrO3, PbTiO3, ZrO2, TiO2, PbO, and other intermediate compounds are absent, and excessive PbO can be obtained.Type: ApplicationFiled: October 4, 2011Publication date: January 26, 2012Applicant: Ulvac, Inc.Inventors: Shouichi HASHIGUCHI, Poong KIM, Takanori MIKASHIMA
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Publication number: 20110265921Abstract: A method for producing a Ta sputtering target including the following steps: (a) a step of forging a Ta ingot, comprising subjecting the Ta ingot to a forging pattern over at least 3 times, wherein each forging pattern is “a cold forging step comprising stamp-forging and upset-forging operations alternatively repeated over at least 3 times; (b) an in-process vacuum heat-treating step carried out between every successive two forging patterns to thus prepare a Ta billet; (c) a step of rolling the Ta billet to obtain a rolled plate; and (d) a step of vacuum heat-treating the rolled plate to obtain a Ta sputtering target. A sputtering target produced by the above method.Type: ApplicationFiled: July 13, 2011Publication date: November 3, 2011Applicant: ULVAC, INC.Inventors: Motonori SATO, Poong Kim, Manabu Ito, Tadashi Masuda
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Publication number: 20110245456Abstract: The present invention relates to a preparation method for a biodegradable polymer microparticle and a microparticle prepared by the method. More particularly, the present invention relates to a method for preparing a polymer microparticle, wherein the method includes the steps of: dissolving a biodegradable polyester-based polymer in DMSO (Dimethyl Sulfoxide); spraying the solution in a low temperature hydrocarbon solution to provide a frozen DMSO microparticle; adding the microparticle in a low temperature salt aqueous solution to dissolve DMSO; and removing salt. The present invention provides a method for preparing a novel polymer microsphere which can be injected through a syringe due to excellent physical properties (such as biocompatibility, biodegradability, porosity, mechanical strength) and the microcarrier's size-adjustability, and can be easily mass-produced.Type: ApplicationFiled: June 13, 2011Publication date: October 6, 2011Applicant: REGEN BIOTECH INC.Inventors: Gun Poong Kim, Yong Hoon Lee, Kun Pil Lee
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Publication number: 20090170685Abstract: To obtain a method of producing a high-density lead zirconium titanate-based sintered body having uniform crystalline phases and containing a large amount of PbO, provided is a method of producing a lead zirconium titanate-based sintered body, including: producing a pre-sintered body by sintering raw material powder of lead zirconium titanate having a stoichiometric composition at a temperature of 900° C. or more and 1,200° C. or less; pulverizing the pre-sintered body; producing lead-excessive mixed powder by adding PbO powder to powder obtained by pulverizing the pre-sintered body; and sintering the lead-excessive mixed powder at a temperature lower than the sintering temperature of the pre-sintered body. Because the sintering process is divided into two stages, a high-density (e.g., 95% or more) PZT sintered body constituted only of PZT having a stoichiometric composition in which PbZrO3, PbTiO3, ZrO2, TiO2, PbO, and other intermediate compounds are absent, and excessive PbO can be obtained.Type: ApplicationFiled: December 19, 2008Publication date: July 2, 2009Applicant: ULVAC MATERIALS, INC.Inventors: Shouichi HASHIGUCHI, Poong KIM, Takanori MIKASHIMA
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Publication number: 20090045053Abstract: To attain a method of producing a lithium phosphate sintered body and a sputtering target capable of providing a high-density bulk body with no macro-size internal defect, the present invention provides a method of producing a lithium phosphate sintered body, including the steps of: calcining raw material powder of Li3PO4 at a temperature set to be 650° C. or more and less than 850° C.; pulverizing and sieving the calcined raw material powder; and sintering the sieved raw material powder to a predetermined shape. By setting a calcining temperature of the raw material powder to be 650° C. or more and less than 850° C., moisture absorbed into the raw material powder is effectively removed and generation of macro-size internal defects in the resultant bulk (sintered) body is suppressed. When the calcining temperature is less than 650° C., calcining processing is insufficient, so generation of macro-size internal defects cannot be suppressed effectively.Type: ApplicationFiled: August 14, 2008Publication date: February 19, 2009Inventors: Poong Kim, Hideaki Nakajima, Manabu Ito, Kouji Hidaka, Takatoshi Oginosawa, Shouichi Hashiguchi, Takanori Mikashima
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Publication number: 20070240795Abstract: A method for producing a Ta sputtering target including the following steps: (a) a step of forging a Ta ingot, comprising subjecting the Ta ingot to a forging pattern over at least 3 times, wherein each forging pattern is “a cold forging step comprising stamp-forging and upset-forging operations alternatively repeated over at least 3 times; (b) an in-process vacuum heat-treating step carried out between every successive two forging patterns to thus prepare a Ta billet; (c) a step of rolling the Ta billet to obtain a rolled plate; and (d) a step of vacuum heat-treating the rolled plate to obtain a Ta sputtering target. A sputtering target produced by the above method.Type: ApplicationFiled: April 13, 2007Publication date: October 18, 2007Inventors: Motonori Sato, Poong Kim, Manabu Ito, Tadashi Masuda
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Publication number: 20060068227Abstract: An Ag-based reflection film consists of a laminate film comprising an Ag or Ag-alloy film provided thereon with a quite thin capping layer. The Ag-based reflection film can be prepared by, for instance, forming, on a substrate, an Ag or Ag-alloy film according to the sputtering technique, while using a sputtering target, for instance, having a composition corresponding to that of the pure Ag film, and Ar gas as a sputtering gas, while adding an additional gas such as O2, only at the initial stage of the Ag or Ag-alloy film-forming step; and then forming a quite thin capping layer, on the Ag or Ag-alloy film, according to the sputtering technique, while using a sputtering target having a composition corresponding to that of the capping layer, and Ar gas as a sputtering gas, while if necessary adding an additional gas such as O2.Type: ApplicationFiled: September 30, 2005Publication date: March 30, 2006Inventors: Sadayuki Ukishima, Satoru Ishibashi, Shigeru Saitou, Poong Kim
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Patent number: 6723213Abstract: A titanium target assembly includes a titanium sputtering target, a copper or copper alloy backing plate and serving as a support member for the target and a silver or silver alloy coating film and formed between the target and backing plate. The coating film is formed on a surface subjected to cleaning treatment on the bonding side or sides of the target and backing plate by physical vapor deposition. The titanium target and backing plate are solid phase diffusion bonded. The face(s) serve as the bonding plane. The assembly can be manufactured by cleaning the surface(s) of the target and/or backing plate on bonding side(s), forming a coating film on the cleaned surface(s) on bonding side(s) and solid phase diffusion-bonding the target and backing plate, while using surface(s) provided with coated film as the bonding plane. The target assembly possesses high bonding strength and excellent bonding stability and reliability.Type: GrantFiled: February 27, 2002Date of Patent: April 20, 2004Assignee: Vacuum Metallurgical Co., Ltd.Inventors: Yasuo Nakadai, Poong Kim, Weiping Chai, Masahiro Kodera
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Publication number: 20020121437Abstract: A titanium target assembly comprises a sputtering target of titanium, a backing plate composed of copper or a copper alloy and serving as a support member for the target and a coating film composed of silver or a silver alloy and formed between the target and the backing plate, wherein the coating film is formed on the surface subjected to a cleaning treatment on the bonding side of the target or on the bonding sides of the target and the backing plate according to the physical vapor deposition technique and the titanium target and the backing plate are solid phase diffusion bonded, while the face(s) provided with the coating film serves as the bonding plane. The titanium target assembly can be manufactured by a method comprising the steps of cleaning the surface(s) of the target and/or the backing plate on the bonding side(s) thereof, forming a coating film on the cleaned surface(s) on the bonding side(s) and solid phase diffusion-bonding the target and the backing plate at a pressure of not more than 0.Type: ApplicationFiled: February 27, 2002Publication date: September 5, 2002Applicant: Vacuum Metallurgical Co., Ltd.Inventors: Yasuo Nakadai, Poong Kim, Weiping Chai, Masahiro Kodera