Patents by Inventor Poopa Ruengsinsub

Poopa Ruengsinsub has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Whisker-free lead frames
    Patent number: 8013428
    Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: September 6, 2011
    Assignee: LSI Corporation
    Inventors: Kultaransingh N. Hooghan, John W. Osenbach, Brian Dale Potteiger, Poopa Ruengsinsub, Richard L. Shook, Prakash Suratkar, Brian T. Vaccaro
  • Whisker-free lead frames
    Publication number: 20090291321
    Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.
    Type: Application
    Filed: July 28, 2009
    Publication date: November 26, 2009
    Applicant: LSI Corporation
    Inventors: Kultaransingh N. Hooghan, John W. Osenbach, Brian Dale Potteiger, Poopa Ruengsinsub, Richard L. Shook, Prakash Suratkar, Brian T. Vaccaro
  • Whisker-free lead frames
    Publication number: 20060068218
    Abstract: The electrical and mechanical properties of structures such as lead frames and other electrical/electronic devices containing, during processing, copper/tin interfaces are improved by introduction of nickel to such interface. Typically, a weight percentage of nickel to tin in the range 1 to 12 weight percent yields upon melting of the tin, an intermetallic compound with essentially no occluded, unbound tin. Thus undesirable anomalous structures such as tin needles and substantially non-planar interface compositions are avoided. Advantageously a nickel/tin/copper intermetallic interface that is substantially planar is formed in the substantial absence of needle-like tin structures.
    Type: Application
    Filed: September 28, 2004
    Publication date: March 30, 2006
    Inventors: Kultaransingh Hooghan, John Osenbach, Brian Potteiger, Poopa Ruengsinsub, Richard Shook, Prakash Suratkar, Brian Vaccaro