Abstract: Methods, storage mediums, and apparatuses for evaluating the reliability of Three-Dimensional (3D) Network-on-Chip (NoC) designs are described. The described embodiments provide a 3D NoC specific fault-injector tool which is able to model logic-level fault models of 3D NoC specific physical faults in 3D-NoC platform. These embodiments automate the whole process of static and dynamic fault injection base on the user preference and reports the specific reliability metrics for 3D NoC platform as a single tool. The described embodiments can be used for the reliability evaluation and effectiveness of fault-tolerant designs in any of the 3D-many core designs such as manycore systems in different ranges of application from embedded systems in cellphones to larger systems which can be used in next generation of autonomous cars or hypercube memory cells.

Abstract: Methods, storage mediums, and apparatuses for evaluating the reliability of Three-Dimensional (3D) Network-on-Chip (NoC) designs are described. The described embodiments provide a 3D NoC specific fault-injector tool which is able to model logic-level fault models of 3D NoC specific physical faults in 3D-NoC platform. These embodiments automate the whole process of static and dynamic fault injection base on the user preference and reports the specific reliability metrics for 3D NoC platform as a single tool. The described embodiments can be used for the reliability evaluation and effectiveness of fault-tolerant designs in any of the 3D-many core designs such as manycore systems in different ranges of application from embedded systems in cellphones to larger systems which can be used in next generation of autonomous cars or hypercube memory cells.