Patents by Inventor Pornthep Sukkhee

Pornthep Sukkhee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9370108
    Abstract: A stencil assembly structure used for printing solder paste on a printed circuit board includes a stencil, a fixing frame, a deformable tube and a gas supplying device. The stencil includes plural first apertures and plural second apertures. The plural first apertures are collaboratively defined as a solder paste printing region. The fixing frame includes a frame body and plural fixing seats, and each fixing seat has a guide pin. After the plural guide pins are penetrated through the corresponding second apertures of the stencil, the stencil is fixed on the fixing seats. The deformable tube is disposed at bottoms of the fixing seats. The gas supplying device is connected with the deformable tube to adjust gas amount in the deformable tube. Due to deformation of the deformable tube resulted from gas pressure in the deformable tube, the guide pins are moved and a tension of the stencil is adjusted.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: June 14, 2016
    Assignee: DET INTERNATIONAL HOLDING LIMITED
    Inventors: Ruay Surasigcha, Pornthep Sukkhee
  • Publication number: 20150245495
    Abstract: A stencil assembly structure used for printing solder paste on a printed circuit board includes a stencil, a fixing frame, a deformable tube and a gas supplying device. The stencil includes plural first apertures and plural second apertures. The plural first apertures are collaboratively defined as a solder paste printing region. The fixing frame includes a frame body and plural fixing seats, and each fixing seat has a guide pin. After the plural guide pins are penetrated through the corresponding second apertures of the stencil, the stencil is fixed on the fixing seats. The deformable tube is disposed at bottoms of the fixing seats. The gas supplying device is connected with the deformable tube to adjust gas amount in the deformable tube. Due to deformation of the deformable tube resulted from gas pressure in the deformable tube, the guide pins are moved and a tension of the stencil is adjusted.
    Type: Application
    Filed: April 29, 2015
    Publication date: August 27, 2015
    Inventors: Ruay Surasigcha, Pornthep Sukkhee
  • Patent number: 9044930
    Abstract: A stencil assembly structure is used for printing solder paste on a printed circuit board. The stencil assembly structure includes a stencil and a fixing frame. The stencil includes plural first apertures and plural second aperture. The plural first apertures are collaboratively defined as a solder paste printing region. The fixing frame includes a frame body and plural guide pins. After the plural guide pins of the frame body are penetrated through the corresponding second apertures of the stencil, the stencil is fixed on the frame body. The guide pins have respective perforations, and a wire is penetrated through the perforations. By selectively loosening or tightening the wire, a tension of the stencil is adjustable.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: June 2, 2015
    Assignee: DET INTERNATIONAL HOLDING LIMITED
    Inventors: Ruay Surasigcha, Pornthep Sukkhee