Patents by Inventor Potapov Sergey

Potapov Sergey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7156285
    Abstract: Provided are a method and apparatus for bonding an element, which has a transparency with respect to UV light, to a substrate. The method includes forming an aluminum layer on a surface of the substrate, disposing the element on the aluminum layer, and bonding the element to the aluminum layer by applying pressure on the element toward the aluminum layer and irradiating UV light on a bonding area between the element and the aluminum layer. The apparatus includes a holder, a pressurizing plate installed at the bottom of the holder to apply pressure on the element toward the substrate and formed of a material having a transparency to UV light, a UV light lamp which is installed in the inner space of the holder, and a collimating lens which is positioned between the UV light lamp and the pressurizing plate and collimates UV light emitted from the UV light lamp.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: January 2, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Potapov Sergey, Ja-nam Ku
  • Patent number: 7113671
    Abstract: An optical coupling device for coupling light to a core of an optical waveguide device. The optical coupling device is connected to the core of the optical waveguide device at a first end and convex at a second end opposite the first. The optical coupling device includes a waveguide connecting the first and second ends of the optical coupling device, for light transmission, and a cladding surrounding the waveguide.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: September 26, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Potapov Sergey, Ja-Nam Ku, Sung-Chul Kim, Il-Jong Song, Dong-Hoon Chang, Seong-Mo Hwang, Eung-Yeoul Yoon
  • Publication number: 20060011705
    Abstract: A compression bonding method includes patterning a metal bonding film in predetermined shapes on a substrate; and disposing a bonded element above the metal bonding film and applying heat to the substrate and pressure to the bonded element, thereby bonding the bonded element to the substrate having the metal bonding film. Since the compression bonding method allows bonded elements having various shapes and sizes to be bonded to a substrate at a low temperature and pressure, manufacturing is simplified, and the compression bonding method can be applied to various sealing and packaging processes.
    Type: Application
    Filed: May 22, 2003
    Publication date: January 19, 2006
    Inventors: Ja-Nam Ku, Potapov Sergey
  • Publication number: 20040131311
    Abstract: An optical coupling device for coupling light to a core of an optical waveguide device. The optical coupling device is connected to the core of the optical waveguide device at a first end and convex at a second end opposite the first. The optical coupling device includes a waveguide connecting the first and second ends of the optical coupling device, for light transmission, and a cladding surrounding the waveguide.
    Type: Application
    Filed: December 22, 2003
    Publication date: July 8, 2004
    Inventors: Potapov Sergey, Ja-Nam Ku, Sung-Chul Kim, Il-Jong Song, Dong-Hoon Chang, Seong-Mo Hwang, Eung-Yeoul Yoon
  • Publication number: 20040118817
    Abstract: Provided are a method and apparatus for bonding an element, which has a transparency with respect to UV light, to a substrate. The method includes forming an aluminum layer on a surface of the substrate, disposing the element on the aluminum layer, and bonding the element to the aluminum layer by applying pressure on the element toward the aluminum layer and irradiating UV light on a bonding area between the element and the aluminum layer. The apparatus includes a holder, a pressurizing plate installed at the bottom of the holder to apply pressure on the element toward the substrate and formed of a material having a transparency to UV light, a UV light lamp which is installed in the inner space of the holder, and a collimating lens which is positioned between the UV light lamp and the pressurizing plate and collimates UV light emitted from the UV light lamp.
    Type: Application
    Filed: August 4, 2003
    Publication date: June 24, 2004
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Potapov Sergey, Ja-Nam Ku