Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer, a second metal layer, at least one layer of device, material sandwiched between the first and second metal layers. A first layer of insulating material substantially covers the first metal layer. A third metal layer is provided on the first layer of insulating material. This third metal layer is divided to provide a first terminal and a second terminal. The first terminal is electrically connected to the first metal layer by a conductive interconnect formed through said first layer of insulating material, and the second terminal is electrically connected to said second metal layer by a conductive path comprising an insulated conductive channel which passes through and is insulated from said first metal layer and said at least one layer of device material.