Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: The present invention includes a substrate having a die adhered thereon. The die and the substrate are interconnected by means of signal transferring means. Solder bumps are formed on the bottom side surface of the substrate. Molding compound is encapsulated among the substrate, the die and a heat spreader. A heat spreader is arranged over the top surface of the substrate. The heat spreader includes a plane having four supporting members that are set on the bottom side of the plane and at the corners of the plane. The supporting members are protruded from the plane to connect the heat spreaders and the substrate. The heat spreader further includes a protruded portion. A further supporting member is formed on the central portion of the protruded portion. The substrate has a die paddle formed thereon for receiving the die. A power ring is formed around the die paddle on the surface of the substrate for power input. A ground ring formed around the power ring on the substrate has ground pads.