Patents by Inventor Poya Lotfizadeh

Poya Lotfizadeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered probe card
    Patent number: 7948252
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: May 24, 2011
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • METHOD OF MANUFACTURING A PROBE CARD
    Publication number: 20080272794
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Application
    Filed: July 15, 2008
    Publication date: November 6, 2008
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes
    Patent number: 7400157
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: July 15, 2008
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • Method of Manufacturing a Probe Card
    Publication number: 20070247176
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Application
    Filed: March 27, 2007
    Publication date: October 25, 2007
    Inventors: Gary Grube, Igor Khandros, Benjamin Eldridge, Gaetan Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • Method of manufacturing a probe card
    Patent number: 7196531
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: March 27, 2007
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Jim Chih-Chiang Tseng
  • Method of manufacturing a probe card
    Publication number: 20050146339
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Application
    Filed: March 4, 2005
    Publication date: July 7, 2005
    Inventors: Gary Grube, Igor Khandros, Benjamin Eldridge, Gaetan Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • Method of manufacturing a probe card
    Patent number: 6864105
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: March 8, 2005
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • Method of manufacturing a probe card
    Publication number: 20030025172
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Application
    Filed: March 1, 2002
    Publication date: February 6, 2003
    Applicant: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng