Abstract: An integrated-circuit device having a layered structure including a plurality of wiring layers with a via layer sandwiched between adjacent wiring layers, wherein: a capacitor having first and second terminals is formed from conductive structures implemented in first and second wiring layers, the conductive structures including arrangements of conductive strips; the strips formed in the first wiring layer are organized into a first-terminal comb arrangement connected to the first terminal and a second-terminal comb arrangement connected to the second terminal, each of comb arrangements having a base strip and a plurality of finger strips extending from the base strip; and the strips formed in the second wiring layer include a plurality of separate strips which constitute finger strips of a cross-layer comb arrangement whose base strip is a finger strip of the first-terminal comb arrangement of the first wiring layer to which those separate strips are conductively connected by vias.

Abstract: An integrated-circuit device having a layered structure including a plurality of wiring layers with a via layer sandwiched between adjacent wiring layers, wherein: a capacitor having first and second terminals is formed from conductive structures implemented in first and second wiring layers, the conductive structures including arrangements of conductive strips; the strips formed in the first wiring layer are organized into a first-terminal comb arrangement connected to the first terminal and a second-terminal comb arrangement connected to the second terminal, each of comb arrangements having a base strip and a plurality of finger strips extending from the base strip; and the strips formed in the second wiring layer include a plurality of separate strips which constitute finger strips of a cross-layer comb arrangement whose base strip is a finger strip of the first-terminal comb arrangement of the first wiring layer to which those separate strips are conductively connected by vias.