Patents by Inventor Prabjit Singh

Prabjit Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072373
    Abstract: A system and method for flushing the electrolyte out of an electrolyte flushable battery apparatus during a thermal runaway event. At least one condition of the electrolyte flushable battery apparatus is monitored to detect a potential thermal runaway event based on the at least one condition exceeding a threshold value. In response the inlet valve and outlet valves on the battery apparatus are opened. A flushing liquid is flushed or pumped through the battery apparatus where the flushing liquid enters the apparatus through the inlet valve and leaves the apparatus through the outlet valve. The flushing liquid is then stored in a reservoir.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: John S. Werner, Andrew C. M. Hicks, Noah Singer, Prabjit Singh, Sadegh Khalili
  • Publication number: 20240057266
    Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 15, 2024
    Inventors: MARK K. HOFFMEYER, PRABJIT SINGH
  • Patent number: 11805603
    Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: October 31, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark K. Hoffmeyer, Prabjit Singh
  • Patent number: 11404287
    Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: August 2, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
  • Patent number: 11202392
    Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: December 14, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dustin W. Demetriou, Michael J. Ellsworth, Jr., Milnes P. David, Prabjit Singh
  • Patent number: 11180398
    Abstract: A deionized-water cooling system for electrical equipment is provided. The system includes a cooling loop in which water comes into contact with the electrical equipment and a deionization bypass connected to the cooling loop. The deionization bypass includes a first filter component configured to remove dissolved oxygen, a second filter component configured to filter solid particles, a deionization cartridge configured to deionize water, and a plurality of valves configured to control a water flow within the deionization bypass.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: November 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Prabjit Singh, Lawrence Palmer, Levi Campbell, Charles Leon Arvin
  • Patent number: 11051407
    Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 29, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Prabjit Singh, Daniel J. Kearney
  • Publication number: 20210120704
    Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 22, 2021
    Inventors: Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR., Milnes P. DAVID, Prabjit SINGH
  • Publication number: 20210111037
    Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
  • Patent number: 10978313
    Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 13, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
  • Patent number: 10950831
    Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 16, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Noah Singer, Prabjit Singh, John G. Torok, David C. Long
  • Patent number: 10952330
    Abstract: A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: March 16, 2021
    Assignee: International Business Machines Corporation
    Inventors: Prabjit Singh, Daniel J. Kearney
  • Publication number: 20200404795
    Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.
    Type: Application
    Filed: June 24, 2019
    Publication date: December 24, 2020
    Inventors: MARK K. HOFFMEYER, PRABJIT SINGH
  • Publication number: 20200392026
    Abstract: A deionized-water cooling system for electrical equipment is provided. The system includes a cooling loop in which water comes into contact with the electrical equipment and a deionization bypass connected to the cooling loop. The deionization bypass includes a first filter component configured to remove dissolved oxygen, a second filter component configure to filter solid particles, a deionization cartridge configured to deionize water, and a plurality of valves configured to control a water flow within the deionization bypass.
    Type: Application
    Filed: June 11, 2019
    Publication date: December 17, 2020
    Inventors: Prabjit Singh, Lawrence Palmer, Levi Campbell, Charles Leon Arvin
  • Patent number: 10739751
    Abstract: A spot welding-type system is provided adapted to facilitate evaluating a rechargeable battery. The system includes first and second electrodes to contact the rechargeable battery. The first electrode includes a first contact surface to facilitate inducing an internal short circuit within the rechargeable battery during operation of the spot welding-type system, and the second electrode includes a second contact surface to contact the rechargeable battery. The first and second contact surfaces are dissimilar contact surfaces, and the second contact surface is larger than the first contact surface. The system with the rechargeable battery disposed between the first and second contact surfaces produces, in operation, a localized pressure on, and a localized heating of, the rechargeable battery in a spot-sized region where the first contact surface contacts the rechargeable battery to facilitate generating and evaluating a potential internal short circuiting of the rechargeable battery.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: August 11, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John G. Torok, Noah Singer, David C. Long, Prabjit Singh
  • Publication number: 20200245469
    Abstract: A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Inventors: Prabjit Singh, Daniel J. Kearney
  • Patent number: 10729016
    Abstract: Shape-memory alloy connectors and methods are provided for enhancing conductivity of a plated through-hole of a circuit board. A shape-memory alloy connector, including a shape-memory alloy material in deformed shape, is inserted into the plated through-hole of the circuit board. The shape-memory alloy connector is expanded within the plated through-hole by heating the shape-memory alloy material to, at least in part, transition the shape-memory alloy material towards a pre-deformed shape of the material. The transitioning of the shape-memory alloy material towards the pre-deformed shape expands the shape-memory alloy connector outward, at least in part, against plating of the plated through-hole to enhance contact of the shape-memory alloy connector with the plating of the plated through-hole.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: July 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Prabjit Singh
  • Publication number: 20200152930
    Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.
    Type: Application
    Filed: November 13, 2018
    Publication date: May 14, 2020
    Inventors: Noah SINGER, Prabjit SINGH, John G. TOROK, David C. LONG
  • Publication number: 20200128676
    Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.
    Type: Application
    Filed: October 23, 2018
    Publication date: April 23, 2020
    Inventors: Prabjit SINGH, Daniel J. KEARNEY
  • Publication number: 20190384254
    Abstract: A spot welding-type system is provided adapted to facilitate evaluating a rechargeable battery. The system includes first and second electrodes to contact the rechargeable battery. The first electrode includes a first contact surface to facilitate inducing an internal short circuit within the rechargeable battery during operation of the spot welding-type system, and the second electrode includes a second contact surface to contact the rechargeable battery. The first and second contact surfaces are dissimilar contact surfaces, and the second contact surface is larger than the first contact surface. The system with the rechargeable battery disposed between the first and second contact surfaces produces, in operation, a localized pressure on, and a localized heating of, the rechargeable battery in a spot-sized region where the first contact surface contacts the rechargeable battery to facilitate generating and evaluating a potential internal short circuiting of the rechargeable battery.
    Type: Application
    Filed: June 18, 2018
    Publication date: December 19, 2019
    Inventors: John G. TOROK, Noah SINGER, David C. LONG, Prabjit SINGH