Patents by Inventor Prabjit Singh
Prabjit Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072373Abstract: A system and method for flushing the electrolyte out of an electrolyte flushable battery apparatus during a thermal runaway event. At least one condition of the electrolyte flushable battery apparatus is monitored to detect a potential thermal runaway event based on the at least one condition exceeding a threshold value. In response the inlet valve and outlet valves on the battery apparatus are opened. A flushing liquid is flushed or pumped through the battery apparatus where the flushing liquid enters the apparatus through the inlet valve and leaves the apparatus through the outlet valve. The flushing liquid is then stored in a reservoir.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: John S. Werner, Andrew C. M. Hicks, Noah Singer, Prabjit Singh, Sadegh Khalili
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Publication number: 20240057266Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.Type: ApplicationFiled: October 25, 2023Publication date: February 15, 2024Inventors: MARK K. HOFFMEYER, PRABJIT SINGH
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Patent number: 11805603Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.Type: GrantFiled: June 24, 2019Date of Patent: October 31, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mark K. Hoffmeyer, Prabjit Singh
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Patent number: 11404287Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: GrantFiled: December 22, 2020Date of Patent: August 2, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
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Patent number: 11202392Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.Type: GrantFiled: October 16, 2019Date of Patent: December 14, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dustin W. Demetriou, Michael J. Ellsworth, Jr., Milnes P. David, Prabjit Singh
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Patent number: 11180398Abstract: A deionized-water cooling system for electrical equipment is provided. The system includes a cooling loop in which water comes into contact with the electrical equipment and a deionization bypass connected to the cooling loop. The deionization bypass includes a first filter component configured to remove dissolved oxygen, a second filter component configured to filter solid particles, a deionization cartridge configured to deionize water, and a plurality of valves configured to control a water flow within the deionization bypass.Type: GrantFiled: June 11, 2019Date of Patent: November 23, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Prabjit Singh, Lawrence Palmer, Levi Campbell, Charles Leon Arvin
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Patent number: 11051407Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.Type: GrantFiled: October 23, 2018Date of Patent: June 29, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Prabjit Singh, Daniel J. Kearney
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Publication number: 20210120704Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.Type: ApplicationFiled: October 16, 2019Publication date: April 22, 2021Inventors: Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR., Milnes P. DAVID, Prabjit SINGH
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Publication number: 20210111037Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: ApplicationFiled: December 22, 2020Publication date: April 15, 2021Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
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Patent number: 10978313Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: GrantFiled: February 20, 2018Date of Patent: April 13, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
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Patent number: 10950831Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.Type: GrantFiled: November 13, 2018Date of Patent: March 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Noah Singer, Prabjit Singh, John G. Torok, David C. Long
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Patent number: 10952330Abstract: A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.Type: GrantFiled: January 24, 2019Date of Patent: March 16, 2021Assignee: International Business Machines CorporationInventors: Prabjit Singh, Daniel J. Kearney
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Publication number: 20200404795Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.Type: ApplicationFiled: June 24, 2019Publication date: December 24, 2020Inventors: MARK K. HOFFMEYER, PRABJIT SINGH
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Publication number: 20200392026Abstract: A deionized-water cooling system for electrical equipment is provided. The system includes a cooling loop in which water comes into contact with the electrical equipment and a deionization bypass connected to the cooling loop. The deionization bypass includes a first filter component configured to remove dissolved oxygen, a second filter component configure to filter solid particles, a deionization cartridge configured to deionize water, and a plurality of valves configured to control a water flow within the deionization bypass.Type: ApplicationFiled: June 11, 2019Publication date: December 17, 2020Inventors: Prabjit Singh, Lawrence Palmer, Levi Campbell, Charles Leon Arvin
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Patent number: 10739751Abstract: A spot welding-type system is provided adapted to facilitate evaluating a rechargeable battery. The system includes first and second electrodes to contact the rechargeable battery. The first electrode includes a first contact surface to facilitate inducing an internal short circuit within the rechargeable battery during operation of the spot welding-type system, and the second electrode includes a second contact surface to contact the rechargeable battery. The first and second contact surfaces are dissimilar contact surfaces, and the second contact surface is larger than the first contact surface. The system with the rechargeable battery disposed between the first and second contact surfaces produces, in operation, a localized pressure on, and a localized heating of, the rechargeable battery in a spot-sized region where the first contact surface contacts the rechargeable battery to facilitate generating and evaluating a potential internal short circuiting of the rechargeable battery.Type: GrantFiled: June 18, 2018Date of Patent: August 11, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John G. Torok, Noah Singer, David C. Long, Prabjit Singh
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Publication number: 20200245469Abstract: A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.Type: ApplicationFiled: January 24, 2019Publication date: July 30, 2020Inventors: Prabjit Singh, Daniel J. Kearney
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Patent number: 10729016Abstract: Shape-memory alloy connectors and methods are provided for enhancing conductivity of a plated through-hole of a circuit board. A shape-memory alloy connector, including a shape-memory alloy material in deformed shape, is inserted into the plated through-hole of the circuit board. The shape-memory alloy connector is expanded within the plated through-hole by heating the shape-memory alloy material to, at least in part, transition the shape-memory alloy material towards a pre-deformed shape of the material. The transitioning of the shape-memory alloy material towards the pre-deformed shape expands the shape-memory alloy connector outward, at least in part, against plating of the plated through-hole to enhance contact of the shape-memory alloy connector with the plating of the plated through-hole.Type: GrantFiled: March 13, 2019Date of Patent: July 28, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Prabjit Singh
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Publication number: 20200152930Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.Type: ApplicationFiled: November 13, 2018Publication date: May 14, 2020Inventors: Noah SINGER, Prabjit SINGH, John G. TOROK, David C. LONG
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Publication number: 20200128676Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.Type: ApplicationFiled: October 23, 2018Publication date: April 23, 2020Inventors: Prabjit SINGH, Daniel J. KEARNEY
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Publication number: 20190384254Abstract: A spot welding-type system is provided adapted to facilitate evaluating a rechargeable battery. The system includes first and second electrodes to contact the rechargeable battery. The first electrode includes a first contact surface to facilitate inducing an internal short circuit within the rechargeable battery during operation of the spot welding-type system, and the second electrode includes a second contact surface to contact the rechargeable battery. The first and second contact surfaces are dissimilar contact surfaces, and the second contact surface is larger than the first contact surface. The system with the rechargeable battery disposed between the first and second contact surfaces produces, in operation, a localized pressure on, and a localized heating of, the rechargeable battery in a spot-sized region where the first contact surface contacts the rechargeable battery to facilitate generating and evaluating a potential internal short circuiting of the rechargeable battery.Type: ApplicationFiled: June 18, 2018Publication date: December 19, 2019Inventors: John G. TOROK, Noah SINGER, David C. LONG, Prabjit SINGH