Abstract: A memory device includes a plurality of memory dies arranged in a stack with electrical connectors configured to transfer signals to and from the memory dies. The memory dies are encapsulated within a first mold compound so that ends of the electrical connectors extend to an active surface of the first mold compound. The first mold compound has a depression in the active surface. A memory controller die is located in the depression. The memory controller die is encapsulated in a second mold compound in the depression and has an active surface that is coplanar with the active surface of the first mold compound.

Abstract: An apparatus includes a tape having a tape thickness extending from a first surface to a second surface and a plurality of cavities formed in the first surface. Each cavity has dimensions along the first surface that are less than dimensions of a corresponding package. Each cavity has a cavity depth that is less than the tape thickness such that a base portion of the tape has a base thickness that is less than the tape thickness.

Abstract: A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

Abstract: A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract: A system is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The system includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.