Abstract: An apparatus for workload management includes a thermal relationship module, a thermal effect module, and a resource allocation module. The thermal relationship module determines a plurality of thermal relationships among components of an electronic device. Each thermal relationship quantifies a thermal impact on one of the components of utilizing another of the components. The thermal effect module determines one or more potential thermal effects of a workload on the components based on the thermal relationships. The one or more potential thermal effects correspond to one or more possible allocations of resources of at least a portion of the components to run the workload. The resource allocation module selects an allocation of resources from the one or more possible allocations of resources to run the workload, based on the determined potential thermal effects.

Abstract: Processing visual cues to improve understanding of an input is described herein, including receiving a visual cue, the visual cue including visual media of a target; storing a list of words representing the target; and updating a probable words dictionary to include the list of words.

Abstract: A method includes a compute node transmitting data to a port of a first switch at a first data transfer rate, monitoring the temperature of the port, and a management node providing an instruction to the compute node in response to the port temperature exceeding a temperature limit, wherein the instruction instructs the compute node to reduce the first data transfer rate to the port. The method further includes the compute node reducing the data transfer rate to the port in response to receiving the instruction. The method is applicable to multiple compute nodes transmitting data to multiple ports of a first switch. The data transfer rate may be reduced by throttling the compute node, renegotiating a link speed between the compute node and the port, or redirecting data to another switch. The methods facilitate thermal control of a switch without its own thermal throttling capability.

Abstract: Systems, methods, and devices for adjusting content of communication between devices for concealing the content from others are disclosed. According to an aspect, a method may be implemented at a communications device including a user interface, a processor, and memory. The method includes receiving a communication for presentation on the communications device. Further, the method includes identifying at least one person located in proximity to the communications device. The method also includes determining a profile of a current user of the communications device. Further, the method includes adjusting content of the communication based on a comparison of a profile of the identified at least one person and the determined profile. The method also includes using the user interface to present the adjusted content to the current user.

Abstract: A method includes a compute node transmitting data to a port of a first switch at a first data transfer rate, monitoring the temperature of the port, and a management node providing an instruction to the compute node in response to the port temperature exceeding a temperature limit, wherein the instruction instructs the compute node to reduce the first data transfer rate to the port. The method further includes the compute node reducing the data transfer rate to the port in response to receiving the instruction. The method is applicable to multiple compute nodes transmitting data to multiple ports of a first switch. The data transfer rate may be reduced by throttling the compute node, renegotiating a link speed between the compute node and the port, or redirecting data to another switch. The methods facilitate thermal control of a switch without its own thermal throttling capability.

Abstract: An apparatus for workload management includes a thermal relationship module, a thermal effect module, and a resource allocation module. The thermal relationship module determines a plurality of thermal relationships among components of an electronic device. Each thermal relationship quantifies a thermal impact on one of the components of utilizing another of the components. The thermal effect module determines one or more potential thermal effects of a workload on the components based on the thermal relationships. The one or more potential thermal effects correspond to one or more possible allocations of resources of at least a portion of the components to run the workload.

Abstract: Processing visual cues to improve understanding of an input is described herein, including receiving a visual cue, the visual cue including visual media of a target; storing a list of words representing the target; and updating a probable words dictionary to include the list of words.

Abstract: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

Abstract: An apparatus for workload execution timing is disclosed. A method and a computer program product also perform the functions of the apparatus. The apparatus includes a job determination module that determines jobs to be executed by a computer system. The apparatus includes a comparison module that compares an execution profile of each job with a resource of a device of the computer system. The execution profile of each job includes an amount of a resource of a device used by the respective job over time. The apparatus includes a scheduling module that determines a schedule that indicates a time to execute each job on the device based on the comparison. Each job is scheduled to maintain a utilization of the resource of the device of the computer system below a maximum threshold. The apparatus includes an execution module that submits the jobs for execution based on the schedule.

Abstract: A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.

Abstract: A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.

Abstract: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.