Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, —C(O)O—, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

Abstract: A slow reacting recyclable epoxy resin system for structural composites is disclosed. The slow reacting recyclable epoxy resin system comprises an epoxy resin component comprising a high purity epoxy resin selected from a high purity Bisphenol A (BPA) epoxy resin, a high purity Bisphenol F (BPF) epoxy resin and a combination thereof wherein the high purity epoxy resin is in a range of 20 to 95 wt. % of the total weight of the epoxy resin component, a standard epoxy resin selected from a standard bisphenol A (BPA) epoxy resin, a standard Bisphenol F (BPF) epoxy resin and a combination thereof wherein the standard epoxy resin is in a range of 1 to 50 wt. % of the total weight of the epoxy resin component; and a curing agent component comprising a curing agent having at least one cleavage linkage selected from a group comprising of an acetal linkage, a ketal linkage, a formal linkage, an orthoester linkage or a siloxy linkage.

Abstract: A method for preparing a solid form of Bisphenol F is disclosed. The method comprises feeding Bisphenol F at a temperature in the range of 130-170° C. into an extruder; processing the fed Bisphenol F in a first mixing zone of the extruder, the first mixing zone maintained at a temperature in the range of 110-130° C., and then in a second mixing zone of the extruder, the second mixing zone maintained at a temperature in the range of 100-110° C.; conveying the processed Bisphenol F to a discharge zone of the extruder, the discharge zone maintained at a temperature in the range of 75-100° C.; discharging the processed Bisphenol F; and obtaining Bisphenol F in the solid form.

Abstract: A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Abstract: Polyol component(s) for a recyclable polyurethane system is disclosed. The recyclable polyurethane system comprises a polyol component having a structural Formula (I), a polyol component having a structural Formula (II) or a polyol component having a structural Formula III and an isocyanate curing agent. A process(es) for preparing the polyol component having the structural Formula (I), the polyol component having the structural Formula (II) and the polyol component having the structural Formula (III) is also disclosed.

Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkyl group having 1 to 32 C atoms, branched alkyl group having 1 to 32 C atoms, Cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biaryl or alkyl substituted biaryl group, methyl bridged aromatic group, cycloaliphatic-aromatic group or Ar—Z—Ar group; X and Y are independently O, —C(O)O—, or an amine group. Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, substituted biaryl group or methyl bridged aromatic group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 with n=0>75%; and N is 1-20.

Abstract: A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa·s at 25° C.

Abstract: An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

Abstract: An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

Abstract: An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

Abstract: A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa·s at 25° C.

Abstract: A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Abstract: Systems, devices, methods, and computer-readable media are discussed herein for assessing performance characteristics of an application executable on a user device and providing an on-device indication of the performance characteristics prior to the application being launched. The on-device indication may take the form of a graphical indicator that provides a user with an indication of the level of performance to expect from the application after the application is launched. In this manner, a user may decide whether the expected level of performance of the application is acceptable to the user prior to actually launching the application.

Abstract: A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.

Abstract: A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.

Abstract: A process for making epoxy resin foam blocks of varying density comprising mixing together (i) a foam resin comprising: a first epoxy resin, a foaming agent to the extent of 2% to 10% of the mass of the epoxy resin, a surfactant to the extent of 2% to 6% of the mass of the epoxy resin, a filler, a toughening agent and (ii) a curing agent comprising: a hardener and a second epoxy resin, the ratio of the foam resin to curing agent being in the range of about 100:20 to 100:25 by mass to form a reaction mixture; pouring the reaction mixture inside a mold maintained at a temperature in the range of 70° to 80° C. and allowing the mixture to cure in the mold for 60 to 100 min.; allowing the mold to cool at a temperature in the range of 15° C. to 30° C. and demolding to obtain a green block; and post-curing the green block in an air circulatory oven for 10 to 15 hrs to obtain a final hard foam block.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.0% with respect to the reaction mass either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs, pouring the resin mix in a mold having an in-situ glass fiber scaffold at a mold temperature in the range of 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C.

Abstract: A process for making epoxy resin foam blocks of varying density comprising mixing together (i) a foam resin comprising: a first epoxy resin, a foaming agent to the extent of 2% to 10% of the mass of the epoxy resin, a surfactant to the extent of 2% to 6% of the mass of the epoxy resin, a filler, a toughening agent and (ii) a curing agent comprising: a hardener and a second epoxy resin, the ratio of the foam resin to curing agent being in the range of about 100:20 to 100:25 by mass to form a reaction mixture; pouring the reaction mixture inside a mold maintained at a temperature in the range of 70° to 80° C. and allowing the mixture to cure in the mold for 60 to 100 min.; allowing the mold to cool at a temperature in the range of 15° C. to 30° C. and demolding to obtain a green block; and post-curing the green block in an air circulatory oven for 10 to 15 hrs to obtain a final hard foam block.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.