Abstract: A system for harvesting electrostatic discharge (ESD) energy in wearable devices is described. The system may include a mechanical or piezoelectric based vibration component to generate static electricity (e.g., triboelectricity) from the interaction between dissimilar materials such as by rubbing skin, hair, or fabric against a wearable device material. The generated static electricity may be captured by an electrostatic discharge (ESD) harvester and converted to power that may be used to recharge an on-board battery, at least partially. The static electricity may be alternatively generated by the user interacting with other objects or materials and harvested by the electrostatic discharge (ESD) harvester.

Abstract: Systems, methods, and apparatuses may provide optical lenses comprising liquid crystal metasurfaces. Systems and methods may include a lens system comprising a first optical lens and a liquid crystal metasurface formed on the first optical lens, and a pair of electrodes positioned on opposite sides of the first optical lens. The pair of electrodes may individually tune sections of the liquid crystal metasurface to adjust an optical characteristic of the optical signal. A waveguide may be configured to receive the adjusted optical signal passed through the first optical lens and may provide the optical signal to an image sensor for an image.

Abstract: According to examples, an interconnect system for integrated circuits (ICs) may be fabricated by processing a substrate implanted with copper wells with a photoresist layer such that remaining portions of the photoresist layer expose portions of the copper wells; depositing a barrier layer over a top surface of the wafer, depositing a seed copper layer over the barrier layer; depositing a copper layer over the seed copper layer; planarizing the copper layer and portions of the barrier layer; depositing another copper layer over exposed portions of the substrate, the copper wells, and the interconnect cores; removing portions of the other copper layer between interconnects by processing the second copper layer with another photoresist layer; and removing remaining portions of the other photoresist layer on the interconnects.

Abstract: Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.

Abstract: A system for polishing a sample is provided. The system may comprise a motor. The system may also include a polishing element that is actuated by the motor. The system may also have a sample holder. The sample holder may hold a sample to be polished by the polishing element. In some examples, the sample holder has multiple degrees of movement in order to precisely polish, grind, or bevel the sample. In some examples, the system may further include an arm having a slurry dispenser, inlets for fluid, and a squeegee-like element to clean, wash, or brush off debris from the polishing element during a polishing process.

Abstract: A semiconductor design that uses high refractive index material between low refractive index material. This structure may act as an optical waveguide.

Abstract: Embodiments of the present disclosure relate to a photomask. The photomask may include: a substrate; and one or more pixel units formed over the substrate. Each pixel unit may include: at least one polymer crystal element configured to interact with extreme ultraviolet (EUV) light based on an orientation of the polymer crystal element; and a plurality of electrodes configured to control the orientation of the polymer crystal element by applying voltage across the polymer crystal element. Each pixel unit is controlled by the respective plurality of electrodes independently, and the one or more pixel units generate a pattern for lithography upon exposure to the EUV light.

Abstract: The disclosed apparatus may include support portions, a frame (such as a base) configured to maintain the support portions in a spaced-apart configuration, a sample holder configured to receive a sample, and a probe assembly including micromanipulators configured to position one or more probes in contact with the sample. The sample holder may rotate between the support portions, and the probe assembly may rotate with the sample holder so that the one or more probes may maintain contact with a sample in the sample holder as the sample holder is rotated, for example, to expose a portion of the sample for processing. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The disclosed system may include a slicing component that has a cutting blade. The cutting blade may be configured to cut a semiconductor wafer into multiple wafer strips, where the wafer strips have flat top surfaces and multiple edges. The system may also include a chuck that has rotatable wafer plate strips that are respectively configured to support the wafer strips. The system may further include a pivot arm that rotates the chuck from a cutting position facing the slicing component to a rotated, polishing position that faces a polishing component. As such, an exposed edge of each wafer strip faces the polishing component. The system may also include a polishing component that is configured to polish at least a portion of the exposed edge of each wafer strip that is facing the polishing component. Various other methods, systems, and computer-readable media are also disclosed.