Patents by Inventor Pradyumna Goli

Pradyumna Goli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220369516
    Abstract: A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.
    Type: Application
    Filed: April 25, 2022
    Publication date: November 17, 2022
    Inventors: Pradyumna Goli, Reid J. Chesterfield, Matthew Bren, Kevin Olson
  • Publication number: 20210212241
    Abstract: A system having a removable electronic component employs an abrasion-resistant thermally conductive film as a thermal interface between the removable electronic component and a heat sink. The abrasion-resistant film reduces thermal impedance between the removable electronic component and the heat sink when the removable electronic component is repeatedly installed and removed from a chamber in a host device. The abrasion-resistant film includes a polymer formed from a silicone-containing resin and an inorganic particulate filler; the film may also be interlocked with a corrosion protection layer at the heat sink. A method of forming a heat sink is provided that minimizes increases in thermal impedance.
    Type: Application
    Filed: March 18, 2021
    Publication date: July 8, 2021
    Inventors: Pradyumna Goli, Justin Kolbe, Reid J. Chesterfield, Paul A. Pedersen