Patents by Inventor Pragna Nannapaneni

Pragna Nannapaneni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TUNGSTEN DEPOSITION
    Publication number: 20220364232
    Abstract: Described herein are methods of filling features with tungsten and related apparatus. The methods described herein involve deposition of a tungsten nucleation layer prior to deposition of a bulk layer. The methods involve multiple atomic layer deposition (ALD) cycles. According to various embodiments, both a boron-containing reducing agent and silicon-reducing agent may be pulses during a single cycle to react with a tungsten-containing precursor and form a tungsten film.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 17, 2022
    Inventors: Pragna NANNAPANENI, Novy TJOKRO, Sema ERMEZ, Ruopeng DENG, Tianhua YU, Xiaolan BA, Sanjay GOPINATH
  • RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION
    Publication number: 20220186370
    Abstract: Provided herein are methods and related apparatus for purging processing chambers during an atomic layer deposition (ALD) process. The methods involve flowing purging gas from one or more accumulators to remove process gases from the processing chambers. Following the flowing of purging gas, additional reactants may be introduced into the processing chamber to continue an ALD cycle.
    Type: Application
    Filed: April 15, 2020
    Publication date: June 16, 2022
    Applicant: Lam Research Corporation
    Inventors: Pragna Nannapaneni, Sema Ermez, Novy Tjokro, Ruopeng Deng, Tianhua Yu, Xiaolan Ba, Juwen Gao, Sanjay Gopinath