Patents by Inventor Pragnesh R. Vaghela

Pragnesh R. Vaghela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
    Publication number: 20180308816
    Abstract: An integrated circuit includes a metal seed layer contacting a metal element of a top interconnect layer, a plated copper pad over the seed layer, a plated metal cap layer on the top surface of the copper pad, an upper protective overcoat covering a lateral surface of the copper pad and overlapping a top surface of the cap layer with a bond pad opening exposing the cap layer, and a bond pad of electroless plated metal in the bond pad opening.
    Type: Application
    Filed: July 2, 2018
    Publication date: October 25, 2018
    Inventor: Pragnesh R. Vaghela
  • Adding cap to copper passivation flow for electroless plating
    Patent number: 10026706
    Abstract: An integrated circuit includes a metal seed layer contacting a metal element of a top interconnect layer, a plated copper pad over the seed layer, a plated metal cap layer on the top surface of the copper pad, an upper protective overcoat covering a lateral surface of the copper pad and overlapping a top surface of the cap layer with a bond pad opening exposing the cap layer, and a bond pad of electroless plated metal in the bond pad opening.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: July 17, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Pragnesh R. Vaghela
  • ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
    Publication number: 20120119364
    Abstract: An integrated circuit includes a metal seed layer contacting a metal element of a top interconnect layer, a plated copper pad over the seed layer, a plated metal cap layer on the top surface of the copper pad, an upper protective overcoat covering a lateral surface of the copper pad and overlapping a top surface of the cap layer with a bond pad opening exposing the cap layer, and a bond pad of electroless plated metal in the bond pad opening.
    Type: Application
    Filed: November 14, 2011
    Publication date: May 17, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Pragnesh R. Vaghela