Abstract: Dual channel showerhead assemblies are described. In some embodiments, the dual channel showerhead assemblies, which include a showerhead upper plate and a showerhead lower plate, enable delivery of mutually incompatible precursors along separate channels that mix in the process zone above a wafer. The dual channel showerhead assemblies provide at least two separate gas paths. In some embodiments, the hole design and hole distribution are configured for minimal jetting effect and plenum volumes for fast purging. The dual channel showerhead assemblies described herein may have a reduced purge out time compared to single channel showerheads, spiral dual channel showerheads, and bonded dual channel showerheads.

Abstract: Gas injector with a vacuum channel having an inlet opening in the front face and an outlet opening in the back face of the injector are described. The vacuum channel comprises a first leg extending a first length from the inlet opening in the front face at a first angle relative to the front face and a second leg extending a second length from the first leg to the outlet opening in the back face at a second angle relative to the front face. Processing chambers and methods of use comprising a plurality of processing regions bounded around an outer peripheral edge by one or more vacuum channel. A first processing region has a first vacuum channel with a first outer diameter and a second processing region has a second vacuum channel with a second outer diameter, the first outer diameter being less than the second outer diameter.

Abstract: What is disclosed herein are embodiments of an enclosed manufacturing system configured to provide a controlled process environment for various articles of manufacture requiring a controlled process environment, and additionally to contain a process environment within the enclosure during periods of external access to the interior of the enclosed manufacturing system. Various embodiments of manufacturing systems of the present teaching can contain the environment within a manufacturing enclosure so as to minimize the interaction of an environment external to a manufacturing enclosure with the internal enclosure environment.

Abstract: What is disclosed herein are embodiments of an enclosed manufacturing system configured to provide a controlled process environment for various articles of manufacture requiring a controlled process environment, and additionally to contain a process environment within the enclosure during periods of external access to the interior of the enclosed manufacturing system. Various embodiments of manufacturing systems of the present teaching can contain the environment within a manufacturing enclosure so as to minimize the interaction of an environment external to a manufacturing enclosure with the internal enclosure environment.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.

Abstract: A light emitting diode (LED) bulb includes a base, a shell connected to the base forming an enclosed volume, a chassis disposed within the shell, and a plurality of LEDs disposed with the shell. The LED bulb also includes a thermally conductive liquid disposed within the enclosed volume. The LEDs and the chassis are immersed in the thermally conductive liquid. The chassis has a first opening and a second opening. The second opening is spaced from the first opening to facilitate a passive convective flow of the thermally conductive liquid to exchange a first volume of the thermally conductive liquid interior the chassis with a second volume of the thermally conductive liquid exterior the chassis.

Abstract: An LED bulb includes a base and a shell connected to the base. The shell is filled with a thermally conductive liquid for cooling the bulb. A plurality of LEDs is disposed within the shell. A first set of LEDs of the plurality of LEDs is positioned a first distance with respect to the center of a convex portion of the shell, and at a first angle with respect to a centerline of the LED bulb. A second set of LEDs of the plurality of LEDs is positioned a second distance with respect to the center of the convex portion of the shell, and at a second angle with respect to a centerline of the LED bulb. The first distance, first angle, second distance, and second angle are selected such that the LED bulb has a light-distribution profile that varies less than 20 percent in light intensity over 0 degrees to 135 degrees as measured from an axis from the center of the shell through an apex of the shell.

Abstract: A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.

Abstract: A substrate processing system includes a thermal processor or a plasma generator adjacent to a processing chamber. A first processing gas enters the thermal processor or plasma generator. The first processing gas then flows directly through a showerhead into the processing chamber. A second processing gas flows through a second flow path through the showerhead. The first and second processing gases are mixed below the showerhead and a layer of material is deposited on a substrate under the showerhead.

Abstract: A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.