Abstract: An inverter unit includes an inverter and an inverter housing. The inverter drives an electric motor and includes at least one power module and a printed circuit board. The power module converts a High Voltage (HV) Direct Current (DC) to a three-phase Alternating Current (AC) that drives the electric motor. The power module includes lead frames to be received in apertures formed on the PCB. The PCB configured with electronic components mounted thereon controls the electric motor. The inverter housing includes a front head and a cover. The cover in conjunction with the front head defines an enclosure for receiving the inverter. The inverter unit includes support elements to support the power module in a hanging configuration with respect to the PCB.

Abstract: An inverter unit (100) includes an inverter (110), an inverter housing (120) and an insulating member (130). The inverter (110) drives an electric motor (200) and includes at least one power module (112) for converting a High Voltage (HV) Direct Current (DC) to a three-phase Alternating Current (AC) that drives the electric motor (200). The inverter housing (120) receives the inverter (110). The power module (112) is mounted on an end wall (120a) of the inverter housing (120) by means of bolts (114). The insulating member (130) corresponding to each bolt (114) is disposed between a head portion (114a) of the corresponding bolt (114) and the power module (112).

Abstract: A stacked-chip assembly including a plurality of IC chips or die that are stacked, and electrically coupled by solder bonds. In accordance with some embodiments described further below, the solder bonds are to contact a back-side land that includes a diffusion barrier to reduce intermetallic formation and/or other solder-induced reliability issues. The back-side land may include an electrolytic nickel (Ni) barrier layer separating solder from a back-side redistribution layer trace. This electrolytic Ni may be of high purity, which at least in part, may enable the backside metallization stack to be of minimal thickness while still functioning as a diffusion barrier. In some embodiments, the back-side land composition and architecture is distinct from a front-side land composition and/or architecture.