Abstract: A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C4-40 bisanhydride; a substituted or unsubstituted C1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C1-40 hydrocarbylene)-NH2, (C1-40 hydrocarbylene)-OH, (C1-40 hydrocarbylene)-SH, (C4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 ?eq/g of the functionalized polyimide, and wherein the polyimide composition has 0.

Abstract: A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a functionalized polyetherimide prepared from a substituted or unsubstituted C4-40 bisanhydride, a substituted or unsubstituted C1-40 organic diamine, and optionally an organic compound, wherein the functionalized polyetherimide includes a reactive end group of the formula (C1-40 hydrocarbylene)-NH2, (C1-40 hydrocarbylene)-OH, (C1-40 hydrocarbylene)-SH, (C4-40 hydrocarbylene)-G, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyetherimide has a total reactive end group concentration of 50-1,500 ?eq/g and 0.

Abstract: A polyisoindolinone includes 1-100 mole percent of isoindolinone ether ketone units of the formula A; and 0-99 mole percent of arylene ether ketone units of the formula B wherein the variables are as defined herein; and wherein when the polyisoindolinone is a poly(isoindolinone ether ether ketone), it has a least one, preferably at least two, preferably all of the following properties: a glass transition temperature greater than 150° C., or 150-270° C. as determined by differential scanning calorimetry, less than 25 weight percent solubility at 23° C. in dichloromethane, orthodichlorobenzene, or chloroform, or substantially no blue phosphorescence in response to irradiation with ultraviolet light of 320-400 nm.

Abstract: A solid epoxy composition comprising: a high heat epoxy compound of one or more of formulas (I) to (IX) provided herein; and an amorphous epoxy compound, wherein the solid epoxy composition has a single glass transition temperature from 35° C. to 100° C., preferably from 40° C. to 95° C., wherein the solid epoxy composition exhibits no other glass transition temperature or crystalline melting point from ?20° C. to 200° C., and wherein R1, R2, Ra, Rb, R13, R14, p, q, c, and t are as provided herein.

Abstract: A high heat epoxy composition comprising: a high heat epoxy compound; a thermoplastic polymer; and a hardener; wherein a cured sample of the high heat epoxy composition has a glass transition temperature greater than or equal to 200° C., preferably greater than 220° C., or preferably greater than 240° C., measured as per ASTM D3418; or wherein a cured sample of the composition has a fracture toughness greater than 150 J/m2, preferably greater than 170 J/m2, preferably greater than 190 J/m2, measured as per ASTM D5045 is provided.

Abstract: A polymer composition that includes, based on the total weight of the polymers: 1-99 weight percent, of a polymer component comprising a polyarylether ketone, a polybenzimdazole, a polyimide, a poly(aryl ether sulfone), a poly(phenylene sulfide), or a combination comprising at least one of the foregoing; and 1-99 weight percent, of a polyisoindolinone, wherein the polyisoindolinone comprises: 1-100 mole percent, preferably 5-100 mole percent, of isoindolinone ether ketone units of the formula (I) and 0-99 mole percent, of arylene ether ketone units of the formula (II) wherein the variables are as defined herein.

Abstract: A curable high heat epoxy composition, comprising: 40 to 95 wt % of at least one high heat diepoxy compound of formulas (I) to (X) as provided herein; 1 to 40 wt % of an auxiliary polyepoxide; 0.01 to 12 wt % of a core-shell particle comprising an elastomer core and a rigid shell; and a hardener.

Abstract: A thermosetting oligomer is disclosed, comprising repeat units of the formula wherein Ar is a C6-32 arylene, preferably a C13-17 diarylene methylene; Ra and Rb at each occurrence are each independently a halogen, C1-12 alkyl, C2-12 alkenyl, C3-8 cycloalkyl, or C1-12 alkoxy, preferably a C1-3 alkyl; R3 at each occurrence is independently a halogen or a C1-6 alkyl group, preferably a C1-3 alkyl; R4 a C1-25 hydrocarbyl, preferably a C1-6 alkyl, a phenyl, or a phenyl substituted with up to five C1-6 alkyl groups, more preferably a C1-3 alkyl or a phenyl; and c, p and q at each occurrence are each independently 0 to 4.

Abstract: A coating powder including particles comprising a diepoxy phthalimidine of the formula (I): wherein R1 and R2 are each independently an epoxide-containing functional group, Ra and Rb at each occurrence are each independently halogen, C1-12 alkyl, C2-12 alkenyl, C3-8 cycloalkyl, or C1-12 alkoxy, R13 at each occurrence is independently a halogen or a C1-C6 alkyl group, p, q, and c are each independently 0 to 4, and R14 is a C1-6 alkyl or phenyl; a curing agent co-curable with the diepoxy phthalimidine; optionally, a cure catalyst; and optionally, an auxiliary epoxy component co-curable with the diepoxy phthalimidine, the curing agent, or both.

Abstract: A bis(benzoxazinyl)phthalimidine has the structure wherein R1, R2, R3, R4, j, and k are defined herein. The bis(benzoxazinyl)phthalimidine is useful as a component of a curable composition. It exhibits a high melting temperature and a high exotherm onset temperature. Also described is a composite that includes a reinforcing filler and the curing product of the bis(benzoxazinyl)phthalimidine.

Abstract: A bis(benzoxazinyl)phthalimidine has the structure wherein R1, R2, R3, R4, j, and k are defined herein. The bis(benzoxazinyl)phthalimidine is useful as a component of a curable composition. It exhibits a high melting temperature and a high exotherm onset temperature. Also described is a composite that includes a reinforcing filler and the curing product of the bis(benzoxazinyl)phthalimidine.

Abstract: High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Abstract: High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Abstract: A high heat epoxy composite including a substrate; a matrix composition comprising: a high heat epoxy compound, and a hardener, wherein the matrix composition comprises 20 to 40 total weight percent of the composite; and wherein a cured sample of the matrix composition has a glass transition temperature of greater than or equal to 200 C; and a cured, laminated sample of the composite has a flexural strength of greater than 850 MPa measured as per ASTM D7264; and a flexural modulus of greater than 65 GPa measured as per ASTM D7264 is provided.

Abstract: A high heat epoxy prepreg, comprising a substrate; a high heat epoxy composition comprising: a hardener; a high heat epoxy mixture comprising: a high heat epoxy compound and an auxiliary epoxy compound different from the high heat epoxy compound; wherein the high heat epoxy mixture has a glass transition temperature between ?10 C and 62 C, wherein the prepreg comprises 40 to 80 volume % substrate, and 60 to 20 volume % of the high heat epoxy composition, wherein the prepreg comprises 12 to 45 volume % of the high heat epoxy compound; wherein the high heat epoxy composition comprises 50 to 75 wt % of the high heat epoxy compound; and a cured, laminated sample of the prepreg has a maximum tensile stress of 800 MPa or greater, measured as per ASTM D 3039, and a modulus of 70 GPa or greater measured as per ASTM D 3039; and a cured sample of the high heat epoxy composition has a glass transition temperature greater than 200 C.

Abstract: A polymer composition that includes, based on the total weight of the polymers: 1-99 weight percent, of a polymer component comprising a polyarylether ketone, a polybenzimdazole, a polyimide, a poly(aryl ether sulfone), a poly(phenylene sulfide), or a combination comprising at least one of the foregoing; and 1-99 weight percent, of a polyisoindolinone, wherein the polyisoindolinone comprises: 1-100 mole percent, preferably 5-100 mole percent, of isoindolinone ether ketone units of the formula (I) and 0-99 mole percent, of arylene ether ketone units of the formula (II) wherein the variables are as defined herein.

Abstract: High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Abstract: Disclosed herein are methods of identifying polymers having particular biological or physical characteristics from in vivo generated libraries of polymers. Methods of generating in vivo polymer libraries are also described. Polymers identified using the methods of the invention are also described.

Abstract: The present invention relates to peptides which exhibit potent anti-retroviral activity. The peptides of the invention are derived from regions of viral fusion proteins referred to as HR1 and HR2. In particular, the invention relates to peptides referred to herein as DP107 and DP178 which comprise amino acid sequences corresponding to sequences found in the HR1 and HR2 regions, respectively of the HIV-1LAI gp41 protein. The invention further relates to “DP107-like” and “DP178-like” peptides that are derived from HR1 and HR2 regions, respectively, of other proteins, including DP107-like and DP178-like peptides derived from the HR1 and HR2 regions of the F1 subunit of the respiratory syncytial virus fusion protein.