Patents by Inventor Pramod Chintaman Karulkar

Pramod Chintaman Karulkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a non-SOI device on an SOI starting wafer and thinning the same
    Patent number: 6391744
    Abstract: A method of thinning a non-SOI device using an SOI thinning process that includes the steps of receiving an SOI starting wafer, where the SOI starting wafer includes a silicon substrate and an oxide layer thereon; selecting a non-SOI fabrication process for fabricating the non-SOI device; forming a layer of device quality silicon on the oxide layer of the SOI starting wafer to a sufficient thickness and doping profile to realize the non-SOI device; fabricating the non-SOI device in the device quality silicon layer using the non-SOI fabrication process selected; forming a support layer on the device quality silicon layer having the non-SOI device fabricated therein; and thinning the result of the last step using the SOI thinning process.
    Type: Grant
    Filed: March 19, 1997
    Date of Patent: May 21, 2002
    Assignee: The United States of America as represented by the National Security Agency
    Inventors: John J. Hudak, Thomas R. Neal, Pramod Chintaman Karulkar